Shulou(Shulou.com)11/24 Report--

CTOnews.com, January 5 (Xinhua)-- Asustek and Intel have joined forces to launch a new chip package for laptops, called Supernova SoM (Supernova SoM), which combines the latest Intel CPU and LPDDR5X memory in the same package.

According to reports, the Supernova SoM design combines Intel's 13th generation CPU chip and LPDDR5X memory together to form a complete package, reducing the PCB area from the original 50*60mm package to the current 42*44.7mm package.

According to Asustek, this "supernova SoM" packaging technology can highly integrate CPU, memory particles and communication modules, reduce the core area of the motherboard by 38%, and improve the overall heat dissipation efficiency of the system. The extra space can accommodate the more powerful RTX4080 unique display, providing users with higher stability and higher GPU performance, thus achieving higher TDP wattage. Compared with traditional packaging technology, supernova SoM shortens the distance between CPU and memory and can run memory at higher frequency.

Asustek's latest Lingyao X Ultra notebook uses this "supernova SoM" packaging technology.

Related readings:

"Asustek releases Lingyao X Ultra Notebook: i9-13905H + RTX 4080 RTX 3.2K 120Hz OLED screen"

Welcome to subscribe "Shulou Technology Information " to get latest news, interesting things and hot topics in the IT industry, and controls the hottest and latest Internet news, technology news and IT industry trends.