Shulou(Shulou.com)11/24 Report--

CTOnews.com December 29 news, Shengmei Shanghai announced that the first glue development Track equipment Ultra LITH with independent intellectual property rights successfully delivered the first former ArF process glue development Track equipment to domestic customers in China, which was shipped by Shengmei Semiconductor equipment (Asia Pacific) Manufacturing Center.

Shengmei Shanghai will launch the i-line model equipment in 2023, and the company has begun to develop the KrF model equipment.

Glue coating development Track equipment glue development Track equipment supports the lithography process, which ensures that the process requirements are met, while optimizing the coating and development steps of the wafer before and after exposure in the lithography equipment.

CTOnews.com learned that Shengmei Shanghai glue development Track equipment is a 300mm wafer process equipment, a total of 4 suitable for 12-inch wafer loading ports, 8 glue-coated cavities, 8 development cavities. The cavity temperature of the equipment can be accurately controlled at 23 °C ±0.1 °C, the baking range is from 50 °C to 250 °C, and the wafer damage rate is less than 50000. In addition, the new structural design for global patent application protection can also be expanded to support 12 glue-coated cavities and 12 development cavities, with a wafer production capacity of up to 300 wafers per hour, and more than 400 wafers per hour in the future with more glue-coating and development cavities.

Shengmei Shanghai is committed to building a wafer-level process solution platform, and its products also include single wafer and trough wet cleaning equipment, electroplating equipment, stress-free polishing equipment, vertical furnace tube equipment, and PECVD equipment.

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