Shulou(Shulou.com)11/24 Report--

December 27 news, According to foreign media reports, In the automobile chip and other semiconductor supply tight period, The wafer foundry and sealing test manufacturers production capacity is also generally tight, The demand for related equipment also increased, Cause the delivery time significantly extended.

However, as demand for consumer electronics slows and the shortage of automotive chips eases, the capacity utilization rate of wafer foundries and test manufacturers also begins to decline significantly, and demand for new equipment also begins to slow down.

The latest news from the industry chain shows that due to weak demand and improved supply conditions, the delivery time of integrated circuit packaging and test equipment has also been significantly shortened.

As the global integrated circuit industry will still face severe challenges of inventory adjustment and business downturn in the future, this means that the demand for integrated circuit packaging and test equipment will not be optimistic for some time to come, and the delivery time will not be extended in the short term.

However, according to the existing industry chain news, the semiconductor supply chain is expected to embark on a growth track in 2024, most wafer fab orders and capacity utilization rate, in the second half of next year is expected to rebound, the capacity demand for closed testing, will then pick up, then the demand for equipment, is expected to increase.

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