Shulou(Shulou.com)11/24 Report--

Thanks to CTOnews.com netizen kinja for the clue delivery! CTOnews.com December 24 news, long Electric Technology recently said on the interactive platform that the company has achieved the 4nm process mobile phone chip packaging. The company cooperates with customers in chip and package design to provide products that meet customer performance, quality, cycle and cost requirements. The company's comprehensive wafer-level technology platform provides customers with a wide variety of options to help customers integrate a variety of advanced packages such as 2.5D and 3D into advanced mobile devices such as smartphones and tablets. to help different customers achieve higher integration, module functions and smaller packaging technical requirements. In the technical solutions to improve heat dissipation performance, the company and industry customers work together to promote chip, package and system collaborative design to achieve common cost and performance optimization.

In terms of finished product manufacturing technology, the company's application of chip back metallization technology to advanced packaging can significantly improve the thermal conductivity of the system. The back metallization technology developed by Changdian Technology can not only improve the heat dissipation of the package, but also enhance the electromagnetic shielding of the package according to the design needs. The company has applied the chip back metallization technology and its manufacturing process to the mass production line.

Changdian Technology said that the company's XDFOI series process for high-density multi-dimensional heterogeneous integration applications has entered a stable mass production phase this month as planned, providing high-density fan-out wafer-level packaging services for customers at home and abroad. The company will keep up with the pace of the market, promote related production capacity construction, enhance technology leadership, and provide customers with diversified multi-dimensional heterogeneous product packaging solutions.

CTOnews.com learned that the XDFOI series of technologies can provide multi-layer extremely high-density wiring and very narrow pitch bump interconnection for high-performance computing applications, and can integrate multiple chips, high-bandwidth memory and passive components to achieve better performance and reliability while optimizing costs.

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