Shulou(Shulou.com)11/24 Report--

CTOnews.com December 23, Samsung released GDDR6W display memory at the end of last month, saying that its bandwidth and capacity have doubled. Now, Samsung China has released an article introducing the technical information of the new video memory.

Samsung said the GDDR6W is based on Samsung GDDR6 products and introduces fan-out wafer-level packaging (FOWLP) technology, which greatly increases memory bandwidth and capacity.

The following figure illustrates how to accommodate twice the number of memory chips in a package of the same size, and how manufacturers develop graphics cards and laptops with twice the bandwidth and graphics DRAM capacity without changing the actual size of the GPU. In other words, compared with the previous design, the same capacity memory can take up 50% less space.

Comparison of GDDR6 and GDDR6W packages it is introduced that FOWLP technology stacks bare memory chips directly on silicon wafers rather than on PCB. To achieve this approach, Samsung uses redistribution layer (RDL) technology to form an extension pattern. In addition, because the PCB is not involved, the thickness of the package is reduced and the heat dissipation capacity is improved.

The thickness of the GDDR6W with FOWLP is 0.7mm, which is 36% thinner than the package thickness of the previous generation 1.1mm. In addition, although the chip is divided into several layers, its thermal properties and performance are still the same as the existing GDDR6. Unlike GDDR6, because the I / O of a single package is larger, the bandwidth of GDDR6W with FOWLP is doubled.

In terms of performance, the newly developed GDDR6W technology can support HBM-level bandwidth at the system level. HBM2E provides system-level bandwidth of up to 1.6TB / s (based on 4K system-level I / O) and per-pin transmission rate of 3.2Gpbs. GDDR6W provides bandwidth of up to 1.4TB / s (based on 512 system-level I / O) and per-pin transmission rate up to 22Gpbs.

Samsung said it was pushing ahead with the standardization of GDDR6W products. Samsung also announced that it will work with GPU partners to expand GDDR6W applications to small package-sized devices such as notebooks and new high-performance accelerators for applications such as artificial intelligence (AI) and high-performance computing (HPC).

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