Shulou(Shulou.com)11/24 Report--

CTOnews.com December 23 news, Godson announced today that it has recently completed the verification of the 32-core Godson 3D5000 prototype chip.

Godson 3D5000, which encapsulates two 3C5000 wafers together through Chiplet technology, is a 32-core CPU product for the server market, Loongson said.

▲ source: Godson data shows that Godson 3D5000 integrates 32 LA464 processor cores and 64MB on-chip shared cache, supports eight memory access channels that meet the DDR4-3200 specification, and can connect I / O expansion bridges and build a single / dual / quad server system through five high-speed HyperTransport interfaces. The function of secure and trusted module is also integrated in Godson 3D5000.

According to reports, Godson 3D5000 is in the form of LGA-4129 package, the chip size is 75.4mm × 58.5mm × 6.5mm, the frequency supports more than 2.0GHz, and the typical power consumption is less than 130W@2.0GHz or 170W 2.2GHz power consumption does not exceed 300W@2.2GHz. The measured SPEC CPU2006 Base scores of single-way and two-way servers are more than 400,800 respectively, and the SPEC CPU2006 Base score of four-way servers is expected to reach 1600.

CTOnews.com learned that Godson said it is working on the production of Godson 3D5000 chips and is expected to provide samples and prototypes to industry chain partners in the first half of 2023.

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