Shulou(Shulou.com)11/24 Report--

CTOnews.com, December 19 (Xinhua) according to Digital Daily, LG Innotek is preparing a FC-BGA (flip Chip Ball Grid Array) service, which has been seen as a new source of revenue. According to industry insiders, LG Innotek is building a FC-BGA production line at the Guiwei plant in Gyeongsangbei. Mass production is planned to begin in the second half of next year.

CTOnews.com learned that FC-BGA (Flip Chip Ball Grid Array) is a printed circuit board for semiconductor packaging, which is also the main packaging format of graphics acceleration chips. It can transmit electrical signals and power supply by connecting high-density semiconductor chips to the motherboard. It is mainly used to connect high-performance and high-density CPU and GPU, but it is very expensive due to technical difficulties.

Toyuan Pexels so far, the FC-BGA market has been dominated by Japan's largest professional manufacturer of printed circuit board development and production (IBIDEN), Shinko Denki and South Korea's Hana Micron, but Samsung Motor, Dade Electronics, Koryo Circuit and other companies are investing heavily, especially Samsung Motor began shipping FC-BGA for servers last month, jumping to the global leading level.

Since Zheng Zhedong became president, LG Innotek has withdrawn from the field of high-density circuit boards (HDI) and light-emitting diodes (LED). After constantly restructuring the business structure, it chose FC-BGA as a new growth point, and decided to invest 413 billion won in this field in February this year, officially entering the market.

According to reports, LG Innotek has a similar manufacturing process of radio frequency (RF) packaging system (SiP) substrate and the fifth generation (5G) mobile communication millimeter wave antenna packaging (AiP) substrate accumulated capacity, it is believed that the company will be more handy in the production of FC-BGA products.

CTOnews.com learned that LG Innotek bought LG Electronics's Kamei A3 plant for 283.4 billion won in June and used it as a FC-BGA production base.

Since then, it has ordered manufacturing facilities and prepared dedicated production lines. Last September, they also showed their FC-BGA prototype to the world. Although the delay in the delivery of the equipment has led to a later than expected progress, LG is expected to start producing such products from next year.

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