Shulou(Shulou.com)11/24 Report--

CTOnews.com news on December 17, according to the release of Nancheng, Suzhou, Core Technology recently held the opening ceremony of a new thousand-class ultra-clean workshop and office in Suzhou Industrial Park. The project covers an area of about 4000m ²and will be used for the R & D and production of large-size bonding equipment and laser bonding equipment.

Core Technology was founded in February 2021, focusing on the R & D, production and sales of semiconductor bonding and unbonding equipment, wafer size 2-12 inches, product applications covering all areas of semiconductors, to provide customers with temporary bonding, permanent bonding overall solution. The company's core R & D teams all have more than 20 years of semiconductor manufacturing experience, of which master's doctoral program accounts for more than 30%, with sales exceeding 90 million in 2021. At present, nearly 50 sets have been shipped and 100 million yuan in financing has been completed this year. In the next 3 years, the annual sales target of core technology will exceed 200 million yuan, with an annual output value of 80 units.

CTOnews.com learned that the wafer bonding machine is the key process equipment to achieve system miniaturization and higher integration of the system, especially one of the key equipment for advanced MEMS and MOEMS manufacturing. The bonding process mainly includes anodic bonding, eutectic bonding and melt bonding. The equipment is mainly used in the packaging testing process in the limit environment reliability test of micro-electromechanical system, providing different types of bonding packaging for all kinds of micro-electromechanical devices, and providing bonding technical support for testing the influence of different materials and bonding conditions on reliability.

There are three carriers in Suzhou Nano City, namely, Ⅰ Zone, Ⅱ Nano Health Industrial Park and Ⅲ third Generation Semiconductor Industrial Park. The total construction area of the carriers is 520000 square meters, and the total construction area of other projects under construction is about 430000 square meters. Among them, the main building of Suzhou Nanacheng enterprise headquarters and high-end R & D base project was capped at the beginning of this year and will be fully put into operation soon. The enterprise headquarters project of the National third Generation Semiconductor Technology Innovation Center, which was developed in the industrialization base project, started the construction of the above-ground main structure in October this year. At the same time, Suzhou Nanacheng is also planning and building new projects one after another for major innovation carriers and enterprise industrialization production bases, which can increase the total construction area by about 930000 square meters after completion.

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