Shulou(Shulou.com)11/24 Report--

CTOnews.com December 15 news, the core equipment of chip manufacturing is the lithography machine. The lithography machine projects the pattern on the photomask onto the silicon wafer by glowing to make a chip. With the increasing precision of the chip, after the lithography machine produces the front process of the semiconductor chip on the silicon wafer, in order to protect the chip from the external environment, it also needs the advanced packaging process, which is called the back process.

In the back process, high-density advanced packaging not only requires high fine wiring, but also needs to be realized by 2.5D technology and cascading 3D technology of multiple semiconductor chips.

To this end, Canon will launch a new product of semiconductor lithography machine-- I-wire step lithography machine "FPA-5520iV LF2 Option" in early January 2023, to achieve high-performance 3D technology through cascading semiconductor chips to meet customers' diversified and high-performance needs while helping customers reduce costs and increase efficiency.

In order to reduce the aberration of the projection optical system, the new product will be applied to the front process lithography machine for the first time to correct the aspheric glass on the back process lithography machine. Compared with the previous model "FPA-5520iV LF Option", the aberration of the new product can be controlled below 1/4, and the stitching between shot can be realized more smoothly.

Improvement of aberration (schematic) at the same time, the new product improves the homogenizer, which can improve the illumination uniformity of the lighting optical system and achieve ultra-high resolution of 0.8 μ m (micron) in a large field of view of 52 × 68 mm. In addition, the new product can achieve a large field of view of more than 100 × 100mm through the splicing exposure of four shot, thus realizing the mass production of super-large and high-density cabling package with the combination of 2.5D and 3D technology, and further promote the development of 3D packaging technology.

The exposure field of view example CTOnews.com learned that the new product inherits many of the basic properties of the semiconductor lithography machine "FPA-5520iV". For example, it can flexibly deal with the problems that hinder the mass production in the packaging process, such as warping of the reconstituted substrate, and measure the Alignment mark on the reconstituted substrate with large chip arrangement deviation, so as to improve the production efficiency.

The new ● product inherits the basic performance implemented in "FPA-5520iV".

The new ● product is equipped with a substrate handling system to deal with the problem of large warping, which can flexibly deal with the problem of large warping of the reconstituted substrate in the mainstream technology used in the packaging of mobile terminals, FOWLP 6, which is also an obstacle to mass production.

The new ● product is equipped with a large field of view Alignment scope, and the Alignment mark can also be measured for the substrate with large chip arrangement deviation.

The new ● product is suitable for Die by Die Alignment technology that locates and exposes on a chip-by-chip basis.

What is the post-process of semiconductor manufacturing

In the semiconductor chip manufacturing process, the semiconductor lithography machine is responsible for the "exposure" circuit pattern. In a series of exposure processes, the process of manufacturing semiconductor chips on silicon wafers is called the front process. On the other hand, the packaging process that protects the precision semiconductor chip from the external environment and realizes the electrical connection with the outside during installation is called the back process.

Welcome to subscribe "Shulou Technology Information " to get latest news, interesting things and hot topics in the IT industry, and controls the hottest and latest Internet news, technology news and IT industry trends.