Shulou(Shulou.com)11/24 Report--

Thank CTOnews.com netizens and independent photographers for their clue delivery! CTOnews.com December 15 news, Changguang core today announced the launch of the first super-large target can be stitched backlit sCMOS image sensor-GSENSE1081BSI. The product is mainly oriented to the field of astronomical observation and can meet the application needs of extreme low-light detection and long exposure.

CTOnews.com learned that the GSENSE series is a scientific-grade CMOS image sensor from Changguang Chenxin, developed for high-end scientific imaging applications, including life sciences, medical imaging, spectroscopy, fluorescence imaging, astronomy, high-energy physics and soft X-rays.

As the largest image sensor on the target surface of long light core, GSENSE1081BSI has a photosensitive area of 89 mm × 91.2 mm and a high resolution of 81 million. For astronomical imaging, the chip adopts a large pixel design of 10 μ m, which can achieve a peak quantum efficiency of more than 95% and high sensitivity thanks to the backlighting technology.

The long light core data show that the GSENSE1081BSI has a full well capacity of 91.7 ke- and a readout noise of less than 5e -, and the dynamic range of a single amplitude can reach 85dB. On-chip 16bit ADC can improve the sampling accuracy of the original signal and retain more abundant luminance information in the picture.

According to reports, according to the application requirements of long exposure and deep cooling in astronomical observation, GSENSE1081BSI has optimized the dark current index. At-70 ℃ degrees Celsius, the dark current is only 0.0026 e-/s/ pixel. The chip uses anti-glowing technology, in extreme temperature conditions, ultra-long exposure time, can also effectively eliminate glow phenomenon.

In addition, the GSENSE1081BSI chip is targeted and optimized in the pixel design, which reduces the intra-pixel response non-uniformity of the chip. At the same time, it adopts the silicon carbide substrate package design that can be spliced on three sides, and carries on the on-chip data transmission through the flexible cable, which is more suitable for large field of view and multi-chip splicing applications.

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