Shulou(Shulou.com)11/24 Report--

CTOnews.com December 14 news, Howie Group recently released the OG0VE Global Shuttle (GS) image sensor. This is a small size, high sensitivity device, suitable for AR / VR / MR, Metaverse, UAV, machine vision, bar code scanners and other products. Compared with the previous generation, the size of this new generation of image sensor is reduced by 26%, and the energy efficiency is improved by more than 50%.

The OG0VE CMOS image sensor uses 3.0 micron pixels based on Howell's OmniPixel 3-GS technology. With its global shutter pixel architecture and excellent low light sensitivity, this sensor can be used in any application that requires instant positioning and mapping (SLAM), gesture detection, head and eye tracking, and depth and motion detection. The product has a resolution of 640 x 480, a chip size of only 3.6 mm x 2.7 mm and a 7.5-inch optical format. Its power consumption is very low. When using VGA to run at a frame rate of 60 frames per second, the power consumption is less than 34 milliwatts.

OG0VE aims to meet the huge demand for small, low-power cameras for AR / VR devices, as battery-powered AR / VR devices require multiple cameras to be installed in limited space for SLAM, Pass-through and tracking functions. The OG0VE image sensor uses Howell's first-class global shutter image sensor technology to meet market demand and is particularly suitable for bringing small-size design flexibility to mainstream AR / VR / MR glasses and helmets. "

According to the MarketsandMarkets report, the AR / VR market is expected to reach $37 billion this year and could reach $114.5 billion by 2027, with a market growth rate of 25.3% within five years.

CTOnews.com learned that the sensor supports single-channel MIPI D-PHY with the highest 800Mbps. The products are in the form of CSP package or bare chip of Howie Group. The OG0VE GS image sensor is now ready for production and will be mass produced by mid-2023.

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