Shulou(Shulou.com)11/24 Report--

IT House, December 12, 2012, Shengmei Semiconductor equipment (Shanghai) Co., Ltd. (referred to as "Shengmei Shanghai"), an equipment supplier providing wafer process solutions for semiconductor foreground and advanced wafer-level packaging applications, today announced the launch of Ultra Pmax plasma enhanced chemical vapor deposition (PECVD) equipment with independent intellectual property rights, expanding an important new product category. Shengmei Shanghai is expected to deliver its first PECVD device to an integrated circuit customer in China within weeks.

Sheng Mei said that the launch of Ultra Pmax PECVD equipment marks a further expansion to a new process field in previous semiconductor applications. Many customers are 28nm and above logic device suppliers, who have predicted that the production capacity of mature process nodes in the Chinese market is obviously in short supply. This PECVD device will enable Shengmei Shanghai to better meet the needs of the global advanced logic and memory chip market.

IT House learned that Shengmei Ultra Pmax PECVD equipment equipped with independent intellectual property rights of the cavity, gas distribution device and chuck design can provide better film uniformity, less film stress and less particle characteristics. The equipment adopts single-cavity modular design and has two configurations: one is that one to three-cavity modules can be configured, which are suitable for polar thin film layers or rapid process steps, and the other is that four-to five-cavity modules can be configured to optimize production capacity at the same time. Support thick film deposition and longer process time. In the above two configurations, each cavity is equipped with multiple heating chucks to optimize process control and increase production capacity.

Shengmei Shanghai is engaged in the development, manufacture and sales of single wafer and trough wet cleaning equipment, electroplating equipment, stress-free polishing equipment, vertical furnace tube equipment and front glue development equipment, which are very important to the advanced integrated circuit manufacturing and advanced wafer level packaging industry. and is committed to providing customized, high-performance, low-consumption process solutions for semiconductor manufacturers. To improve their multi-step production efficiency and product yield.

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