Shulou(Shulou.com)11/24 Report--

Thanks to CTOnews.com netizens Wu Yanzu in South China for the delivery of clues! CTOnews.com December 9 news, according to TechPowerUp news, Changjiang Storage today released the X3-9070 TLC 3D NAND flash memory with Xtacking 2022 architecture at the Flash Summit (FMS) 3.0.

According to reports, the new generation of X3-9070 flash memory of Changjiang Storage has achieved I / O speed as high as 2400MT / s, complying with the ONFI standard and improving the performance of the previous generation of products by 50%.

In addition, leveraging the innovative architecture of Xtacking 3.0, the X3-9070 has become the highest bit density flash memory product in Changjiang memory history, achieving the storage capacity of 1Tb in an ultra-compact single chip package. The X3-9070 flash memory uses an innovative 6-plane design that can improve system performance by up to 50% and reduce power consumption by up to 25% compared to the 4-plane architecture.

CTOnews.com learned that the Xtacking technology of Changjiang Storage is called Crystal Stack in Chinese. Officials said that before the introduction of the crystal stack architecture, 3D NAND on the market was mainly divided into traditional parallel architecture and CuA (CMOS under Array) architecture. Through innovative layout and careful verification, after 9 years of technology accumulation in 3D IC field and 4 years of research and development verification, the key technology of wafer bonding has finally been realized on 3D NAND flash memory.

The latest TiPlus 7100 SSD flash memory should be X3-9070.

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