Shulou(Shulou.com)11/24 Report--

Thanks to CTOnews.com netizen OC_Formula for the clue delivery! CTOnews.com, December 8 (Xinhua)-- according to Canon's official news, Canon will launch a new product of semiconductor lithography for post-process, the I-line step lithography machine "FPA-5520iV LF2 Option", in early January 2023.

According to ▲ FPA-5520iV LF2 Option, FPA-5520iV LF2 Option has a high resolution of 0.8 μ m and four shot splices with less exposure distortion, making it possible to expose 100 × 100mm with a large field of view, thus realizing the mass production of a super-large high-density cabling package with a combination of 2.5D and 3D technology.

▲ splices four exposure shot to form a large package (4shot x 4).

▲ 2.5D technology and 3D technology schematic map compared with the previous model "FPA-5520iV LF Option" (launched in April 2021), this new product can reduce the aberration to less than 1/4. The new product is equipped with a brand-new projection optical system and an illumination optical system with better illumination uniformity.

At the same time, the new product inherits many features of the previous generation, for example, it can flexibly deal with the problems that hinder the mass production in the packaging process, such as warping of the reconstituted substrate, and measure Alignment mark on the reconstituted substrate with large chip arrangement deviation, so as to improve the production efficiency.

CTOnews.com learned that in the semiconductor chip manufacturing process, the semiconductor lithography machine is responsible for "exposure" circuit patterns. In a series of exposure processes, the process of manufacturing semiconductor chips on silicon wafers is called the front process. On the other hand, the packaging process that protects the precision semiconductor chip from the external environment and realizes the electrical connection with the outside during installation is called the back process.

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