Shulou(Shulou.com)11/24 Report--

CTOnews.com news on December 5, according to the investor relations activity records disclosed by Lanci today, Lanci said that with the steady increase in the penetration of DDR5-related products, the company's revenue from memory interface chips and supporting chips for memory modules increased in the third quarter of 2022, thus promoting the growth of the interconnection chip product line.

According to reports, the demand for memory interface and module supporting chips is positively related to the number of server memory modules. The demand for memory capacity in the industry continues to increase, in order to meet the demand for memory capacity growth, mainly through two ways, one is to increase the memory particle density, the other is to increase the number of memory modules. If the increase of memory particle density slows down in a certain period of time, the demand for memory capacity growth will be more dependent on increasing the number of memory modules, which will lead to the growth of memory interface and module supporting chip demand. At the same time, in the case of low prosperity in the server industry, customers will improve system performance by adding the number of memory modules / capacity of the stock server. In addition, according to industry standards, the demand for chips supporting memory modules in the DDR5 generation will increase significantly.

CTOnews.com learned that Lan Qi Technology expects that with the gradual increase in the number of CPU that supports DDR5, it will further improve the DDR5 ecology and increase the penetration of DDR5 memory modules. The company has mass-produced DDR5 memory interface chips and memory module supporting chips, the improvement of DDR5 memory module permeability will drive the company's DDR5 related chip sales continue to grow.

In addition, Lan Qi Technology said that the AI chip developed by the company adopts near-memory computing architecture, which is mainly used to solve the problems of CPU bandwidth, performance bottleneck and GPU memory capacity bottleneck in the reasoning application scenario of AI computing under big data's throughput, and to provide customers with a low-latency and efficient AI computing solution, which is equivalent to the special accelerator of CPU. At present, the company's AI chip research and development is smooth. This year, the company continues to promote the software and hardware coordination and performance optimization of AI chips, while actively promoting the preparation of the first-generation AI chip engineering samples, and is expected to complete the first-generation AI chip engineering samples by the end of 2022.

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