Shulou(Shulou.com)11/24 Report--

CTOnews.com, November 25, according to the Taiwan Economic Daily, wafer foundry manufacturers are actively laying out more advanced process nodes, and when the production capacity of 1 nanometer process node will become the focus.

According to the industry forecast, according to the current 3x2 nanometer mass production schedule and industrial development, it is speculated that the trial production may be in 2027 and 2028 at the earliest, but the situation of individual manufacturers may be different.

CTOnews.com learned that the major wafer manufacturers are currently actively planning more advanced process investment. Wei Zhe-Jia, president of TSMC, has repeatedly announced that 3nm of SMC will be mass produced in Taiwan this year and 2nm in 2025. However, TSMC did not announce a production schedule for more advanced processes below 2 nanometers.

In addition, Samsung Electronics' wafer foundry division stressed that 1.4 nanometers of its most advanced technology will be introduced into mass production in 2027, with related capacity investment aimed at applications such as high-performance computing and artificial intelligence.

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