Shulou(Shulou.com)11/24 Report--

CTOnews.com November 25, CES 2023 will be held from January 5 to 8, but Samsung already has a number of innovative products on the CTA list, such as the environmental innovation of Galaxy Z Flip4 and Galaxy Z Fold4, Samsung S3B512C security chip, Samsung 16GB LPDDR5X+1TB UFS 3.1 multi-chip packaging technology and so on.

According to reports, Samsung 16GB LPDDR5X and 1TB UFS 3.1 multi-chip packaging technology is the first time to integrate 14nm-based 16GB LPDDR5X DRAM and Samsung seventh generation four-layer memory cell (QLC) V-NAND 1TB UFS (Universal Flash Storage) 3.1 products, showing a technological leap forward in the leading industry.

Samsung's UFS-based integrated multi-chip package has won awards in the embedded technology category for a wide range of high-end smartphones and electronics, as well as other industry-leading high-density, high-speed, low-power memory applications for flagship products, such as the LPDDR5x+ UFS 4.0Iron Triangle, which will soon be available in Snapdragon 8 Gen2 phones.

CTOnews.com learned that highlights of the Samsung CTA Innovation Awards also include AI appliances, SmartThings Energy, Samsung 990 PRO SSD 2TB solid state drives, automotive NVMe BGA SSD 1TB (AM991), 512GB CXL memory cards, Samsung ISOCELL HP3 CMOS sensors, Samsung W920+RF 6550 next-generation wearable device enhancements, and so on.

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