Shulou(Shulou.com)11/24 Report--

CTOnews.com, November 24, more information about the Samsung Galaxy S23 component supply chain has emerged. Samsung is replacing one of its existing HDI PCB (high-density interconnect printed circuit boards) suppliers because of an acquisition beyond its control, the report said.

Samsung has been working with Ibiden, a Japanese supplier of HDI boards, for many years. Ibiden supplies HDI components for many generations of Samsung's Galaxy S-series products; however, Ibiden's HDI plant in Beijing is reported to have been acquired by a different company planning to produce other types of components, meaning its HDI-based partnership with Samsung is over.

The Japanese company will no longer provide HDI boards for the Galaxy S series, implying that Galaxy S23 products are involved. Samsung has signed another agreement to acquire HDI boards from another supplier.

Although Ibiden pulled out of Samsung's HDI board supply chain as a result of the acquisition, Samsung is reported to be transferring HDI orders to Meiko, another Japanese board supplier.

The latter has also been a supplier of printed circuit boards to Samsung, so it is not a new member of Samsung's supply chain. However, with the withdrawal of Ibiden, Meiko is expected to receive more orders for HDI boards for the Galaxy S23 series from Samsung.

CTOnews.com has learned that the Samsung Galaxy S23 series is expected to be released in January or February 2023, while Samsung has begun developing firmware for its upcoming flagship aircraft. In addition, the 2023 models will fully use Qualcomm Snapdragon 8 Gen 2 chip. There are rumors that the Samsung Galaxy S23 series will benefit from exclusive SoC models that are highly optimized for the One UI experience.

Samsung Galaxy S23 series is expected to be equipped with a stronger camera system. Samsung will adjust its supply chain to ensure that new phones are not affected and that the experience is guaranteed.

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