Shulou(Shulou.com)11/24 Report--

CTOnews.com August 18 news, Chen Fang, deputy director of TSMC (China) Co., Ltd. said at the 2022 World Semiconductor Congress that the N3 chip will be mass produced in the second half of this year and has been delivered to some customers in the mobile and HPC (high performance computing) fields. If customers with mobile phones adopt 3nm chips now, the products will be available next year.

CTOnews.com has reported that the Industrial and Commercial Times said that after the completion of technical research and development and trial production of TSMC's 3nm (N3) process, it is expected that the number of films will begin to rise sharply in the second half of the third quarter, and the monthly number of films in the fourth quarter will reach the level of thousands, and will begin to enter the stage of mass production.

Semiconductor equipment industry pointed out that according to the trial production of TSMC's N3 process, it is expected that after entering mass production in September, the initial quality rate performance will be better than the initial stage of the previous 5nm (N5) process.

Wei Zhe-Jia, president and co-chief executive of TSMC, has previously said that TSMC's N3 process is in line with expectations and will be mass produced in the second half of 2022 with a good rate of quality products. Driven by HPC (high-performance computer cluster) and smartphone-related applications, the N3 process will be in stable mass production in 2023 and will begin to contribute revenue in the first half of 2023.

At the same time, the N3E (3nm enhanced version) process will be an extension of TSMC's 3nm family, and its research and development results will also be better than expected, with better efficiency, power consumption and quality rate, and will provide a complete support platform for smart phones and HPC-related applications in the 3nm process era. The N3E process will go into mass production in the second half of 2023, and Apple and Intel will be the two main customers.

According to reports, TSMC 3nm still uses fin field effect transistor (FinFET) architecture, but N3 process has adopted innovative TSMC FINFLEX technology, which further improves the PPA (efficiency, power efficiency and density) of 3nm family technology.

At the same time, TSMC also said at the 2022 technology seminar that when 3nm process technology is launched, it will be the most advanced technology in the industry in terms of PPA and transistor technology, and is confident that the 3nm family will become another large-scale and long-term process node of TSMC.

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