Shulou(Shulou.com)11/24 Report--

The rapid development of the domestic semiconductor industry releases the strong market demand for equipment. Under the influence of the complex international situation and other factors, the process of equipment localization has been empowered.

Incomplete statistics of microgrid show that more than 30 equipment projects made new progress in the first half of 2022. Among them, there are more than 18 contracted projects, more than 14 projects under construction, and more than 2 projects that have been completed and put into production. From the point of view of the link, the wafer manufacturing and testing equipment project is quite hot.

Overview of equipment projects in the first half of 2022: Jiangsu has intensive projects and high heat in wafer manufacturing direction according to microgrid statistics, it is found that from January to June 2022, contracted / started projects are mainly concentrated in the Yangtze River Delta region, accounting for more than 70% of the total number of projects. Among them, the wafer manufacturing and testing equipment direction projects are in the majority, accounting for nearly 70% of the total number of projects in the region.

Specifically, in the Yangtze River Delta region, Jiangsu projects take the lead in accounting for more than 40%, followed by Zhejiang and Shanghai.

In Jiangsu, equipment projects in Suzhou and Wuxi were intensively landed and started in the first half of the year, including the first phase investment Deying Ruichuang semiconductor equipment project (300 million yuan), Changchuan science and technology semiconductor AOI equipment business headquarters project, Shengfeng electronic semiconductor advanced process equipment R & D and mass production project (550 million yuan), Zhuocheng Micro Semiconductor equipment (Kunshan) Co., Ltd semiconductor equipment production project (300 million yuan), etc.

According to the manufacturing process, semiconductor equipment is divided into wafer manufacturing equipment, packaging equipment and testing equipment, and wafer manufacturing and testing equipment projects are more hot. Set microgrid statistics show that in January-June equipment contracts and start projects, wafer manufacturing equipment accounted for 34%, followed by test equipment accounted for 32%, packaging equipment accounted for 19%.

In addition, from January to June, the overall progress promoted by equipment projects showed a steady and high trend, and March and April were the most exciting part of the signing of equipment projects in the first half of the year.

Contract signing at a glance of some projects

Honghao Semiconductor equipment Development Project

Honghao Optoelectronics invested in the construction of semiconductor precision processing plant and R & D laboratory in Nanhai District of Foshan. The project covers an area of about 50 mu, with a total planned investment of about 2 billion yuan, including a total investment of 1.2 billion yuan in fixed assets.

Jingsheng R & D Center (Hangzhou) and Semiconductor Intelligent equipment Manufacturing Base Project

The project has a total investment of 1.03 billion yuan and signed a contract in Hangzhou Linping District, which will build Jingsheng R & D Center (Hangzhou) and semiconductor intelligent equipment manufacturing base.

Shanghai Yanzi thin Film deposition equipment Project

The project is contracted to Qingdao Laixi Economic Development Zone. Shanghai Yanzi Intelligent Technology Co., Ltd. focuses on the manufacturing and production of chemical thin film deposition equipment, which is the core process of semiconductors, and its core product, VPE reactor, has been independently controlled. The Laixi project has a total investment of 500 million yuan. after it is put into production, it will become the third semiconductor film deposition equipment company in Shandong Province to access the chip head production line and achieve mass production.

Deying Ruichuang Semiconductor equipment Project

Project signed Yixing Economic Development Zone, Deying Ruichuang semiconductor intelligent equipment phase I project with a total investment of 300 million yuan, will build SiC silicon carbide slicing equipment, semiconductor testing equipment, semiconductor film equipment production line.

Changchuan Technology Semiconductor AOI equipment Business headquarters

Changchuan Technology Semiconductor AOI equipment Business headquarters project is located in Suzhou Industrial Park. It is the first independent semiconductor AOI business headquarters established by Changchuan Science and Technology in China. It is planned that in the next five years, Suzhou company will have 600 personnel and more than 150 intellectual property applications.

Start

Core source microelectronic integrated circuit front key equipment R & D and production project

The project, with an estimated construction period of 30 months, will be implemented by Shanghai Xinyuan Micro Enterprise Development Co., Ltd., a wholly-owned subsidiary of the company, with a total planned investment of 640 million yuan. after the project is completed and reaches production, it is mainly used for R & D and production of high-end semiconductor special equipment such as ArF lithography coating developer, immersion lithography developer and single-chip chemical cleaning machine.

Zhongsheng Semiconductor Research and Development Center and industrialization Base Project

Zhongsheng semiconductor R & D center and industrialization base project has a total investment of 540 million yuan, covering an area of 23 mu. The main investor of the project is Zhongsheng Semiconductor (Shanghai) Co., Ltd., focusing on the R & D, production, sales and technical services of key MOCVD (metal organic chemical vapor deposition) equipment and technology for the production of second-and third-generation semiconductor discrete devices.

Changchuan Technology Integrated Circuit High-end Intelligent Manufacturing Base Project

Changchuan Technology's landing project in Hangzhou is mainly capacity expansion. The project, with a construction area of about 137000 square meters, will integrate R & D, production, office, testing, service and other functions to meet the company's high-end equipment R & D and manufacturing needs.

Research and Development of Advanced process equipment and Mass production Project of Shengfeng Electronics Semiconductor

The project will be invested in two phases and will develop semiconductor packaging and testing equipment, IC carrier board process equipment, integrated circuit board printing equipment and vacuum plug process equipment business. Set up R & D center and package test center to locate the operation of enterprise headquarters.

Completion / commissioning

The main factory building of Shanghai Zhongwei Port industrialization Base (Phase I) is capped.

The project is located in Shanghai Lingang Integrated Circuit Industrial Park, with a total construction area of about 180000 square meters. After 133days, the project has been successfully capped. After the project is completed, it will meet the needs of R & D, testing and industrialization of integrated circuit and pan-semiconductor equipment.

Advanced Technology (Huizhou) Co., Ltd. Chip packaging equipment Phase III project capping

The ASM project introduced by Huizhou, Guangdong, was completed in mid-June, which will bring an annual production capacity of 3000 sets of semiconductor, LED\ CMOS image sensors and other chip packaging equipment.

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