Shulou(Shulou.com)11/24 Report--

CTOnews.com, August 18, according to Taiwan's Economic Daily, Samsung forcefully attacked the advanced foundry process of wafer foundry. After announcing that 3nm was leading the industry in mass production at the end of June, 4nm yield significantly improved and is starting to expand production. It is expected that Q4 will increase its production capacity by 20,000 pieces per month this year, and plans to spend about 5 trillion won (about 25.8 billion yuan) on 4nm to compete with TSMC. Want to snatch more foundry orders from Qualcomm, AMD, Nvidia and other big manufacturers from TSMC.

For related news, Samsung said it could not confirm the increase in production and investment. TSMC also did not respond to relevant competitor information yesterday.

The industry pointed out that in the past, about 60% of Samsung's wafer foundry production capacity provided its own chip production, and the rest accepted outside orders. This year, Samsung actively expanded production and expanded wafer contract manufacturing orders, reducing the proportion of its own chip production capacity to 50%. The research institute estimates that Samsung is still only about 1/5 of TSMC's advanced process capacity.

CTOnews.com learned that the first batch of chips manufactured by Samsung Electronics using 3nm process technology were officially shipped on July 25. Their process, which is the first in the industry to use full-surround gate transistor architecture, has a mass production and delivery time earlier than their competitor TSMC.

In April this year, it was reported that Samsung 4nm node production capacity has been delayed, but has entered the expected yield curve; its 5nm good product rate has entered the mature stage, which means that the good product rate has reached Samsung's expected level. There are rumors that Samsung Electronics OEM's 4nm production has been delayed, leading big customers such as Nvidia to entrust the new generation of OEM products to TSMC.

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