Shulou(Shulou.com)11/24 Report--

Thanks to CTOnews.com netizen OC_Formula for the clue delivery! CTOnews.com8 18 news, according to Taiwan's "Industrial and Commercial Times" reported that after the completion of technical research and development and trial production of TSMC 3nm (N3) process, it is expected that the number of films will begin to rise sharply in the second half of the third quarter, and the monthly number of films in the fourth quarter will reach the level of thousands, starting to enter the stage of mass production.

The main production base of ▲ TSMC 3nm-- Wafer 18 Plant

Semiconductor equipment industry pointed out that according to the trial production of TSMC's N3 process, it is expected that after entering mass production in September, the initial quality rate performance will be better than the initial stage of the previous 5nm (N5) process.

Wei Zhe-Jia, president and co-chief executive of TSMC, has previously said that TSMC's N3 process is in line with expectations and will be mass produced in the second half of 2022 with a good rate of quality products. Driven by HPC (high-performance computer cluster) and smartphone-related applications, the N3 process will be in stable mass production in 2023 and will begin to contribute revenue in the first half of 2023.

At the same time, the N3E (3nm enhanced version) process will be an extension of TSMC's 3nm family, and its research and development results will also be better than expected, with better efficiency, power consumption and quality rate, and will provide a complete support platform for smart phones and HPC-related applications in the 3nm process era. The N3E process will go into mass production in the second half of 2023, and Apple and Intel will be the two main customers.

CTOnews.com learned that at the end of July, Samsung announced that it had mass-produced 3nm process, which is the first semiconductor company in the industry to adopt full-surround gate transistor architecture, but some experts have revealed that when using 3nm process OEM, Samsung Electronics' current main task is still to improve the rate of quality products.

According to the Industrial and Commercial Times, TSMC 3nm still uses fin field effect transistor (FinFET) architecture, but N3 process has adopted innovative TSMC FINFLEX technology, which further improves the PPA (efficiency, power efficiency and density) of 3nm family technology.

At the same time, TSMC also said at the 2022 technology seminar that when 3nm process technology is launched, it will be the most advanced technology in the industry in terms of PPA and transistor technology, and is confident that the 3nm family will become another large-scale and long-term process node of TSMC.

In addition, the Industrial and Commercial Times previously reported that people in the industry said that Apple will become the first customer to use TSMC 3nm by the end of this year, and the first product may be M2 Pro chip (or it will be used in new products such as Mac Pro). Next year, including the new iPhone 15 Pro special A17 application chip, as well as M2 and M3 series chips, will be imported into TSMC 3nm.

At the same time, Intel will also expand the use of 3nm to produce tiles in processors in the second half of next year. AMD, Nvidia, Qualcomm, MediaTek and Broadcom will gradually complete the 3nm chip design and begin mass production in 2023-2024.

Welcome to subscribe "Shulou Technology Information " to get latest news, interesting things and hot topics in the IT industry, and controls the hottest and latest Internet news, technology news and IT industry trends.