Shulou(Shulou.com)11/24 Report--

Thanks to the CTOnews.com netizen Mr. Air, kinja for the clue delivery! CTOnews.com November 21, according to Shengmei Shanghai release, Shengmei Semiconductor equipment (Shanghai) Co., Ltd. (referred to as "Shengmei Shanghai") is a supplier of wafer process solutions for semiconductor foreground and advanced wafer-level packaging applications, successfully launched glue-coated development Track equipment, the company officially entered the glue-coated development Track market. The company has previously upgraded its expertise in the areas of cleaning, gluing and development.

Shengmei Shanghai developed the first package coating machine and developer in 2013 and delivered it to customers in 2014. Shengmei Shanghai will deliver the first ArF process glue development Track equipment to Chinese domestic customers in a few weeks, and the i-line model equipment will be launched in 2023. In addition, the company has begun to develop KrF model equipment.

Equipment highlight

Shengmei Shanghai glue development Track equipment is a 300mm wafer process equipment, can provide uniform downdraft, high-speed and stable manipulator processing and powerful software system to meet the specific needs of customers. The equipment has various functions and can reduce the rate of product defects, increase production capacity and save total cost of ownership (COO). The glue-coated development Track equipment will support a variety of lithography processes, including i-line, KrF and ArF systems.

The glue development Track equipment supports the lithography process, which ensures that the process requirements are met, while optimizing the coating and development steps of the wafer before and after exposure in the lithography device. CTOnews.com learned that the device is designed for 300mm wafers and has 4 loading ports for 12-inch wafers, 8 gelatinized cavities and 8 development cavities. The cavity temperature of the equipment can be accurately controlled at 23 °C ±0.1 °C, the baking range is from 50 °C to 250 °C, and the wafer damage rate is less than 50000. In addition, the new structural design for global patent application protection can also be expanded to support 12 glue-coated cavities and 12 development cavities, with a wafer production capacity of up to 300 wafers per hour, and more than 400 wafers per hour in the future with more glue-coating and development cavities.

Shengmei Shanghai focuses on advanced integrated circuit manufacturing and advanced wafer-level packaging manufacturing industry, R & D, production and sales of monolithic and trough wet cleaning equipment, electroplating equipment, stress-free polishing equipment and vertical furnace tube equipment. And provide customized, high-performance, low-consumption process solutions to semiconductor manufacturers to improve customer multi-step production efficiency and product yield.

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