Shulou(Shulou.com)11/24 Report--

CTOnews.com, November 21 (Xinhua) TSMC founder Zhang Zhongmou said in an interview on Monday that the 5nm plant currently set up in Arizona is the most advanced process in the United States, but TSMC's most advanced process has reached 3nm. He himself confirmed that TSMC will set up the most advanced 3-nanometer wafer fab in the United States.

CTOnews.com learned that the 12-inch wafer plant invested by TSMC in Arizona will hold a relocation ceremony on December 6. TSMC said that it plans to invite guests, including customers, suppliers, academia and government representatives, to celebrate the important milestone of the first batch of machines and equipment to the factory, which will also be attended by Zhang Zhongmou and his wife. In addition, the US Secretary of Commerce has agreed to attend the "first machine transfer" ceremony at TSMC's Arizona fab. Zhang Zhongmou said that the US Secretary of Commerce will fly from Washington to Arizona with an one-way flight time of six hours and a round trip of 12 hours, which is a full day's journey.

TSMC pointed out that with the arrival of machinery and equipment, it means that the plant has been partially completed, and then it will be ready to move into the first batch of cutting-edge equipment for semiconductor manufacturing. Construction of the 5nm plant in Arizona started about 18 months ago as expected and will begin mass production in 2024 with a monthly production capacity of 20,000 pieces.

I was asked whether TSMC's most advanced three-nanometer process could be transferred to other countries, such as the United States. Zhang Zhongmou said "yes". Zhang Zhongmou said that now there is a plan, but it has not been completely finalized. It should be said that it is almost finalized, that is, in the same Arizona, "three nanometers is phase 2 (second stage) and five nanometers is phase 1 (first stage)."

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