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2025-03-01 Update From: SLTechnology News&Howtos shulou NAV: SLTechnology News&Howtos > IT Information >
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Shulou(Shulou.com)11/24 Report--
CTOnews.com November 21, ISSCC International Conference on solid State Circuits, known as the "Olympics" in the field of integrated circuits and semiconductors, brings together relevant breakthroughs and advances in the world's top and most cutting-edge semiconductor fields.
The 70th ISSCC Conference will be held in San Francisco on February 19. More than 3000 researchers from more than 30 countries and regions will attend the conference, such as Samsung, SK Hynix, TSMC, MediaTek, Sony, Intel and other enterprises and universities.
Professor Jaehyouk Choi KAIST, a member of the ISSCC committee, said ISSCC considered the practicality and commercial feasibility of the proposed technology, and more than half of the participants were chip companies.
CTOnews.com has reported that at a preliminary news conference held by ISSCC in South Korea last week, officials have introduced the technology to be demonstrated at the conference.
ISSCC 2023 received a total of 629 papers, of which only 198 passed the screening, involving analog, digital converter, digital architecture and systems, digital circuits, IMDD, RF, wireless, wired, memory and other technologies.
Of the 198 papers, 32 are from South Korea, 59 from mainland China and 42 from the United States. For the first time, the number of papers in mainland China has surpassed that of the United States and South Korea. Officials say the quality of papers submitted by Chinese scholars is excellent in ISSCC 2023, covering topics ranging from machine learning to processors.
Samsung, as a company, was selected for eight papers, making it the commercial company with the largest number of accepted papers, although it accounted for only half of the 16 papers they submitted, TheLec reported.
According to reports, one of the hot areas of ISSCC 2023 is the power management IC, accounting for 12% of the selected papers. However, South Korea does not have any related papers, and Professor Min-Kyu Je of KAIST said in a speech at the preparatory meeting that the country lags behind the global average in areas such as gallium nitride and power transmission equipment.
In this regard, several universities in Greater China account for the largest proportion of IC papers on power management, and their research on Internet of things data converters is also very advanced. Currently, a total of 15 DC-related papers will be published on ISSCC 2023, of which 11 are from China (including Hong Kong, Macau and Taiwan).
In terms of digital architecture and systems, AMD and MediaTek are expected to showcase their latest 5nm and 4nm processors.
Ji-Hoon Kim, a professor at Lihua Women's University, said that research on Internet of things systems related to high-performance processors, mobile application processors, cars and energy collection is very active. It is said that there is also research on 3D stacking and direct bonding packaging technology based on 5nm and 4nm.
Of course, every country has its own areas of expertise. South Korea, for example, is the strongest in the field of image sensors and display-driven IC. ISSCC 2023 of the 18 papers accepted in this category, 9 are from South Korea.
In addition, Samsung will also submit papers on a four-pixel 50MP CMOS image sensor and display driver IC for 8K televisions and game displays. At the same time, South Korea also has a great advantage in memory chip papers, and papers in this field account for 11% of the total received papers, which is also the second largest category after power management IC.
It is said that SK Hynix plans to showcase its V-NAND technology with more than 300 layers.
In other areas, nine papers related to SRAM CIM were also selected, most of them from China (including Hong Kong, Macao and Taiwan). These studies are mainly focused on the applications of artificial intelligence and machine learning.
"China ranks first in the world for the first time, according to the announcement of the number of papers included in ISSCC, the International Conference on Integrated Circuits."
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