Shulou(Shulou.com)11/24 Report--

CTOnews.com, November 17, 2022, the core released its new FotonixTM platform, which integrates high-performance RF, digital CMOS and silicon photon (SiPH) circuits on the same chip, while leveraging the scale, efficiency and strict process control of 300mm chip production.

In the areas of data center interconnection, optical networking, photonic computing, fiber-to-the-home (FTTH) and joint packaging optics, the grid core has identified this innovative technology to meet the most urgent, complex and difficult challenges of today and tomorrow.

And what is the next step in bringing silicon photonic technology into the hands of manufacturers and end customers? Create an end-to-end ecosystem for silicon optics. Photonic technology is very important for expanding the cell core in the market. Grid Core says it is working with industry leaders in packaging, EDA tools and other key categories to help its silicon photonic portfolio to create an end-to-end ecosystem that enables its customers to develop and manufacture innovative chips.

According to GE Core, partner Fabrinet is a supplier of advanced optical packaging and precision optical, electromechanical and electronic manufacturing services to original equipment manufacturers of complex products, including optical communication components, modules and subsystems, automotive components, medical devices, industrial lasers and sensors. Combined with cell core expertise, Fabrinet has realized a passively arranged optical fiber array with high fiber number, which is used to input and output light from silicon photonic chips. This development leverages Fabrinet's existing mature manufacturing technology for optical components and components, as well as co-packaged optics, eliminating the need for transceivers by packaging silicon switching circuits and optics in modules or packages.

CTOnews.com has learned that using silicon photon samples from the cell core and sharing its process expertise, Fabrinet has now demonstrated the optical fiber connectivity of the 90nm silicon photonics process.

The two companies are also working together to introduce fiber connectivity into cell core 45nm platform technologies, including cell core Fotonix silicon photonic wafers, which are expected to be fully tested and certified by the end of 2022.

With the support of the cell core, wafers with fiber connections developed by Fabrinet will fully meet Telcordia industry standards by the end of 2022.

Silicon photons are regarded as a major breakthrough in the production of silicon chips. The process of converting highly advanced chips from production to products is extremely complex. This process starts with the availability of silicon and relies on an ecosystem that provides EDA tools, design suites, software, packaging innovation, testing tools, and other elements to form a complete silicon solution.

As silicon photon-based chips are available in bulk later this year, the industry is expected to see significant absorption in these applications: high-performance computing, optical quantum computing, artificial intelligence, telecommunications, networking, virtual and augmented reality, defense and aerospace.

Fabrinet provides a wide range of advanced optical and electromechanical capabilities throughout the manufacturing process, including process planning and engineering, supply chain management, manufacturing, advanced packaging, integration, final assembly and testing. Fabrinet specializes in producing any combination and any number of highly complex products. Fabrinet has engineering and manufacturing resources and facilities in Thailand, the United States, China, Israel and the United Kingdom.

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