Shulou(Shulou.com)11/24 Report--

CTOnews.com, November 14, vivo officially announced today that the new flagship mobile phone vivo X90 series and Hi-Fi wireless headset vivo TWS 3 series will be released at 19:00 on November 22.

According to previous revelations, the new vivo X90 series will include X90, X90 Pro and X90 Pro + versions, which will be equipped with Tianji 9200, Tianji 9200 and Snapdragon 8 Gen2 flagship platforms, respectively. It is worth mentioning that the vivo X90 series will be the world's premiere Tianji 9200 chip.

Another blockbuster new vivo TWS 3 series headset boasts a new generation of LE Audio Bluetooth audio technology and supports Bluetooth 5.3, the industry's first full-link wireless true Hi-Fi, as well as intelligent ultra-wideband noise reduction, non-inductive body temperature monitoring, low latency in LC3 games, and multi-device dual connections.

According to the previous preheating, the vivo TWS 3 series headphones have a transmission rate of up to 1.2Mbps, equipped with high-performance DAC chips, and will be equipped with ultra-wideband HD units above 40kHz.

According to the latest running scores posted by Han Boxiao, the product manager of vivo, the vivo X90 rabbit carrying Tianji 9200 has a running score of 1284467.

CTOnews.com learned that the chip is based on TSMC's 4nm process, and its CPU part uses an eight-core architecture of "1: 3: 4", which is composed of 1*3.05GHz X3+3*2.85GHz A715+4*2.0GHz A510 and GPU is Immortalis-G715 MC11. This is also the first GPU under Arm to support hardware ray tracing, which can bring more realistic and immersive light and shadow effects.

"vivo X90 series official picture unveiled: the first Tianji 9200, equipped with Zeiss one-inch main shot, V2 chip, 120W fast charge"

"vivo TWS 3 series real Hi-Fi wireless headphones official announcement: Bluetooth 5.3, LE Audio, non-sensory body temperature monitoring, etc."

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