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2025-01-19 Update From: SLTechnology News&Howtos shulou NAV: SLTechnology News&Howtos > IT Information >
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Shulou(Shulou.com)11/24 Report--
CTOnews.com, November 5 news, when Intel set up the foundry department at the beginning of 2021, the cost of the production nodes of the major wafer factories has been pushed up to a very high level, even higher and higher, and Intel also has the strength to compete with Samsung and TSMC.
In fact, Intel said from the beginning that it wanted the division to become a contract factory on a par with Samsung and TSMC. It now seems that the company's current plan is to make it the second largest contract factory by 2030.
Randhir Thakur, president of Intel contract manufacturing services, said in an interview with Nikkei Asia: "our goal is to become the second largest contract manufacturing company in the world by the end of the 1920s. [we] want to see substantial contract manufacturing profit margins."
To be second in the global contract manufacturing market means Intel must beat Samsung Electronics.
Samsung generated more than $20 billion in foundry revenue in 2021, according to TrendForce, and is expected to exceed that figure in 2022.
As of the first quarter of 2022, Samsung had about 16.3% of global contract manufacturing revenue, lagging far behind market leader TSMC (53.6%), but significantly ahead of peers UMC (6.9%) and Groupon (5.9%).
By contrast, Intel's IFS business unit has revenue of $576 million so far this year. Once the acquisition of Tower Semiconductor in early 2023 is completed, Intel's IFS division will increase revenue by about $1.5 billion a year, so it can be transformed into the world's seventh or eighth generation factory, but still far lower than Samsung in terms of revenue.
To become the world's second largest contract chip manufacturer, Intel must adopt a multifaceted strategy, including the following:
Develop cutting-edge process technology to compete with Samsung and TSMC in terms of power, performance and area (PPA), while also considering the rate of return and time to market.
Provide leading production capacity for IFS customers.
Through the innovation of mature technology, maintain the operation and competitive position of Tower Semiconductor.
Orders mainly come from current contract manufacturing customers of TSMC and Samsung, and may also steal some customers from GlobalFoundries and SMIC.
Big Action CTOnews.com has reported that Intel has previously given a rather aggressive process technology roadmap, including mass production on its 18A process in 2025 and, if possible, the introduction of high-NA extreme UV lithography for the 18A platform.
Intel's production node plan is much more aggressive than Samsung and TSMC. Both Samsung and TSMC plan to start producing 2-nanometer (20-Emm) chips in 2025, but this is the time for initial production.
In terms of semiconductor production capacity, Intel's plan has not made any concessions. The company is building 20A Fab 52 and Fab 62 plants at a base near Chandler, Arizona; the first two 18A/ 20A plants at a base near Columbus, Ohio; advanced packaging equipment valued at $3.5 billion; a new Intel 4 plant near Reclipp, Ireland; and a brand new plant near Magdeburg, Germany.
Overall, Intel plans to invest about $100 billion in new semiconductor manufacturing facilities over the next few years.
"We have been in contact with contract manufacturing customers since the launch of IFS, and it is clear that many of these companies believe that a more resilient and geographically balanced semiconductor supply chain is needed," Thakur said.
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