Shulou(Shulou.com)11/24 Report--

CTOnews.com, Nov. 4, Newswire announced today that the digital and customized design process has been certified for TSMC's upgraded 3nm (N3E) process. The combination of this process and its foundation and interface IP has achieved a number of successful tape out in TSMC's N3E production process, which can help customers speed up research and development.

DanKochpatcharin, head of TSMC's design infrastructure management department, said that the Electronic Design Automation (EDA) and IP's latest achievements in TSMC's N3E process technology have brought powerful solutions to both customers to help them meet the stringent power, efficiency and area goals of innovative designs.

TSMC 3nm process will be mass produced in this quarter (fourth quarter). TSMC President Wei Zhe Jia previously said that the progress of N3E technology development is ahead of schedule and is expected to be mass produced in the second half of 2023.

CTOnews.com Science Popularization, Xinsi Technology Co., Ltd. is an American electronic design automation company and IC interface IP supplier, focusing on chip design and verification, chip intellectual property and computer security, not related to Cisco.

SanjayBali, vice president of marketing strategy for the Silicon Crystal implementation business group, said that the recent results represent another important milestone in the continued and successful cooperation between Xinshi and TSMC and will provide designers with ways to meet their key design requirements.

TSMC's N3e process expands its 3nm process range with better power consumption, efficiency and yield, and can meet the needs of workload-intensive applications such as high-performance computing, AI artificial intelligence and mobile, according to Xinshi Technology.

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