Shulou(Shulou.com)11/24 Report--

CTOnews.com, Nov. 2 (Xinhua) according to semiconductor engineering expert Tom Wassick, the AMD Auron 7000 processor appears to have been upgraded to prepare for the upcoming 3D V-Cache model.

Wassick found more TSV columns in the Zen 4 CCD, indicating that the 3D cache model of the new Ruilong 7000 processor can provide more bandwidth on hardware than the Ryzen 7 5800X3D.

CTOnews.com science popularization: Silicon wafer through hole (Through Silicon Vias,TSV) is the latest direction of three-dimensional laminated silicon device technology. Stereoscopic (3D) vertical integration of copper interconnects through silicon through holes (TSV) is currently considered one of the most advanced technologies in the semiconductor industry, achieving greater space efficiency and higher interconnection density than wire bonding and flip chip stacking solutions.

It is said that there are two larger, denser TSV arrays on the Ryzen 7000 chip, with some reduced spacing-and additional TSV columns. This means that the Ruilong 7000 3D V-Cache substrate will have more contact areas with CPU, resulting in greater L3 cache bandwidth and possible additional power.

3D V-Cache is a technology introduced by AMD to stack L3 cache, which doubles the L3 cache on its chip by adding 64MB's SRAM cache to Ryzen's CCD, thus significantly improving the actual performance of workloads that are sensitive to L3 cache, especially games.

The only consumer-oriented 3D V-Cache chip released by AMD is the R7 5800X3D, which shares 96MB's L3 cache.

For the additional TSV contacts in the Ruilong 7000 above, this means that AMD is preparing higher bandwidth performance for its second-generation stack cache, even exceeding the 2Tbps bandwidth of the Auron R7 5800X3D.

Some netizens believe that this (additional contact) may also be one of the reasons for the high power supply of this generation of AMD processors. After all, the extra power can also provide a stronger performance guarantee for V-Cache, but it ultimately depends on the choice of AMD design, and subsequent 3D models may be more efficient and more power-efficient than current models.

To put it simply, these extra TSV don't represent the performance of AMD's next-generation 3D V-Cache, or it must be much better than the normal 5800X3D or Auron 7000 model, but it does mean that the Ruilong 7000X3D will bring more bandwidth than 7 5800X3D.

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