Shulou(Shulou.com)11/24 Report--

Thanks to CTOnews.com netizen OC_Formula for the clue delivery! CTOnews.com, October 22, whistleblower @ OneRaichu claimed that Intel Core Arrow Lake series dual platforms seem to use different process technologies.

He said that the ARL-S series for desktop platforms will use TSMC's state-of-the-art 3nm family process (combined with previous intelligence, it is likely to be N3E), while low-voltage platforms for mobile platforms will still use their own Intel 20A process.

The Intel 20A process node can improve the performance of CPU by 15% per watt and introduce RibbonFET and PowerVia technologies to the desktop platform.

In addition, others added: Intel had previously chosen to apply ARL-P and ARL-S to TSMC's N3 process for some reasons, but with the delay of TSMC's N3 and the release of the P series later than the S series, ARL-P can be smoothly transferred to the Intel 20A platform, which is scheduled for mass production in the first half of 2024.

Existing intelligence shows that Intel Meteor Lake (2023) and Arow Lake will adopt Foveros (3D) packaging technology, based on 36 μ m pitch packaging process, based on Intel 4 (formerly 7nm) and Amy-level 20A process, respectively, while the launch platform of Intel 3 process is not yet clear.

CTOnews.com learned that Intel Arrow Lake will use exactly the same "small chip" configuration as the 14-generation Core Meteor Lake, the P core will upgrade from Redwood Cove to Lion Cove, and the E core will switch from Crestmont to Skymont, and the number of cores may increase to 832.

Also benefiting from the modular design, Arrow Lake will be able to retain Meteor Lake's quasi-system solutions, including SoC and IO modules, speeding up architecture and process upgrades while helping to reduce costs.

The Arrow Lake will use the same LGA-1851 slot as the Meteor Lake, in line with Intel's principle of using the same design for every second-generation platform, and then the Lunar Lake will confirm that it is 18A process + Foveros, 25 μ m pitch packaging process, while Nova Lake is not yet known, but there are unreliable rumors that CPU performance has improved by more than 50%.

To sum up, Meteor Lake CPU will adopt a new small chip (Tile) tiling architecture, with three main Tile: IO Tile, SOC Tile and Compute Tile. Compute Tile includes CPU Tile and GFX Tile. CPU Tile will use a new hybrid core design to provide higher performance with lower power consumption, and GPU is also a new architecture, up to 192 EU.

It has been rumored that the Arc GPU core of the Meteor Lake series of small chips will use TSMC N5 / N3 process, and the whistleblower seems to mean that all Arrow Lake-S will adopt TSMC 3nm process and immerse themselves in the research and development of the next generation 20A process node.

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