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In the first half of the year, the revenue of the top 10 manufacturers in the global semiconductor closed test is about 17.5 billion US dollars: the top three of Sunlight, Anqu and Changdian Technology.

2025-01-21 Update From: SLTechnology News&Howtos shulou NAV: SLTechnology News&Howtos > IT Information >

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CTOnews.com, October 14, the latest CINNO Research report shows that in the first half of 2022, the market revenue of the top 10 manufacturers in semiconductor closed testing increased to about $17.5 billion (about 125.475 billion yuan), an increase of about 16.7 percent over the same period last year.

According to the report, the Top10 ranking of finalists is consistent with that of companies in the first half of 2021. Among them, there are 5 enterprises in Taiwan, 3 in Chinese mainland, 1 in the United States and 1 in Singapore.

CTOnews.com learned that CINNO Research said that in the future, with the continuous increase of 5G communication technology, Internet of things, big data, artificial intelligence, visual recognition, autopilot and other application scenarios, the demand for chips with lighter volume, faster data transmission rate and lower power loss in the industry will continue to increase, while advanced packaging, as an important means to continue Moore's Law, has become a major increment in the global closed test market in the future. The market size will continue to grow.

The top 10 semiconductor closed test (OSAT) operations released by CINNO Research in the first half of 2022 are as follows:

No.1: revenue of Nikko and Moon Holdings (ASE) increased by about 27.1% year-on-year, ranking first. Revenue from automotive electronics, a closed-end testing business, grew 54 per cent in the first half of 2022 compared with last year, due to strong end demand due to growth in HPC, automotive, 5G and IoT and expanding silicon content.

No.2: Amkor ranked second with 13.5% year-on-year growth in revenue. Revenue from this segment increased by 27% year-on-year due to increased demand for data centers and high-performance computing, while revenue from automobiles and industries rose 16% year-on-year. Due to the stickiness of the customer base and the binding of long-term cooperation agreements, the capacity utilization of WB and Lead Frame is still quite stable.

No.3: JECT ranks third with revenue growth of about 8.5% compared with the same period last year. Changdian Technology has industry-leading semiconductor advanced closed testing technology in important fields such as 5G communications, high-performance computing, consumer, automotive and industry. The company will further promote the production and application of high-density integrated SiP integration technology, 2.5D / 3D wafer-level microchip integration technology and the introduction of customer products.

No.4: Powertech ranks fourth with an 8.9% year-on-year increase in revenue. Licheng Technology's revenue in the first half of the year was the highest in the same period in history. Under the demand of data center, automotive electronics and high-level computing, the demand for DRAM capacity remains stable. NAND&SSD will also be affected by falling sales in the consumer electronics market and inventory adjustments, but demand in data centers will remain. The company will continue to maintain the development of Flip Chip and advanced closed test technology in logic chip business.

No.5: TFME ranked fifth with revenue growth of about 33.4% over the same period last year. The substantial growth of Tonfu Micro Power closed test revenue is due to the simultaneous breakthroughs made by various major bases. Chongchuan Factory, Nantong Tongfu, Hefei Tongfu and Tongfu Chaowei have respectively completed the introduction and mass production of many new products and breakthroughs for key customers, and it is expected that customer 5nm products will be mass produced on a small scale in the second half of the year.

No.6: HT-Tech ranks sixth with revenue growth of about 6.9% compared with the same period last year. Huatian Technology now has a Chiplet packaging technology platform, and has completed the process development of large-size eSiFO products, and has passed chip-level and board-level reliability certification.

In addition, United Science and Technology (UTAC), Jingyuan Electronics (KYEC), Nanmao Technology (ChipMOS) and Bang Technology (Chipbond) ranked seventh to 10th, respectively.

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