Shulou(Shulou.com)11/24 Report--

Thank you, Mr. Air, a netizen of CTOnews.com, for your clue delivery! CTOnews.com news on October 11, Shenzhen Development and Reform Commission issued on the 8th "Shenzhen measures to promote the high-quality development of semiconductor and integrated circuit industry (draft for soliciting opinions)" (hereinafter referred to as "draft for soliciting opinions").

The draft proposes to speed up the research and development of chips based on reduced instruction set architectures such as RISC-V, and subsidize RISC-V chip design enterprises that invest more than 10 million yuan (including 10 million yuan) in R & D, up to a maximum of 10 million yuan per year. Shenzhen enterprises that sell self-developed chips with a cumulative sales amount of more than 20 million yuan shall be rewarded according to 15% of the sales amount of the current year, up to a maximum of 10 million yuan.

In addition, Shenzhen will focus on breaking through the design of high-end general-purpose chips such as CPU, GPU, DSP and FPGA, and laying out the development of special chips such as artificial intelligence chips and edge computing chips. We will speed up the research and development of EDA core technologies, promote the localization of EDA tools such as analog, digital and radio frequency integrated circuits, and support the research and development of advanced process processes, a new generation of intelligent, ultra-low power consumption and other EDA technologies. It is reported that Shenzhen will grant subsidies to enterprises or scientific research institutions that buy domestic EDA tools software according to no more than 70 per cent of the actual expenditure, up to 10 million yuan a year.

The full text of the consultation draft is attached to CTOnews.com:

Shenzhen on promoting Semiconductor and Integrated Circuit Industry

Some measures for high-quality development

(draft for soliciting opinions)

In order to implement the strategic plan of the CPC Central Committee and the State Council on the development of the integrated circuit industry, promote the key breakthroughs and overall upgrading of our city's semiconductor and integrated circuit industry, cultivate a sound industrial ecology, and enhance the core competitiveness of the industry, fully link up with some measures on speeding up the Development of Integrated Circuit Industry (Shenfu regulations (2019) No. 4) Combined with the Shenzhen Action Plan for the cultivation and Development of Semiconductor and Integrated Circuit Industry clusters (2022-2025), the following measures are formulated in accordance with the principles of precision and operation, and combined with the actual situation of our city.

1. Applicable institutions and key support areas this measure applies to integrated circuit design, manufacturing, packaging and testing, equipment and materials enterprises where the places of registration, statistics and tax payment are all in Shenzhen, or enterprises, institutions or organizations that provide related integrated circuit industry services. Unless otherwise stipulated in the specific provisions of these measures.

This measure focuses on supporting the design of high-end general-purpose chips, special-purpose chips and core chips, compound semiconductor chips, etc.; silicon-based integrated circuit manufacturing; gallium nitride, silicon carbide and other compound semiconductors; high-end electronic components manufacturing; wafer-level packaging, 3D packaging, Chiplet (core) and other advanced packaging and testing technologies; EDA tools, key IP core technology development and application Lithography, etching, ion implantation, deposition, testing equipment and other advanced equipment and key parts production; as well as core semiconductor materials research and development and industrialization.

Second, comprehensively enhance the core links of the industrial chain (1) to achieve a breakthrough in core chip products. Focus on breaking through the design of high-end general-purpose chips such as CPU, GPU, DSP, FPGA, and the development of special chips such as artificial intelligence chips and edge computing chips. With the 5G communications industry as the traction, we will comprehensively break through the core chips such as RF front-end chips, baseband chips, optoelectronic chips and so on. Focus on pan-IoT applications such as intelligent "terminals" to promote the rapid industrialization of ultra-low power dedicated chips and NB-IoT chips. For enterprises to purchase IP to carry out high-end chip research and development, and give IP up to 20% of the actual payment, with a total amount of no more than 10 million yuan per year for a single enterprise. We will speed up the research and development of chips based on reduced instruction set architectures such as RISC-V, and subsidize RISC-V chip design enterprises that invest more than 10 million yuan (including 10 million yuan) in R & D, up to 10 million yuan per year. Those who sell self-developed chips to Shenzhen enterprises with a cumulative sales amount of more than 20 million yuan shall be rewarded according to no more than 15% of the sales amount of the current year, up to a maximum of 10 million yuan.

(2) to strengthen the support to design enterprises for taping. Actively coordinate the integrated circuit production lines and pilot lines supported by Shenzhen to open up a certain production capacity to serve the streaming needs of small and medium-sized design enterprises in Shenzhen. Support integrated circuit design enterprises to step up research and development of new products, with emphasis on supporting integrated circuit design enterprises in the production of tapes and masks. Shenzhen enterprises that use multi-project wafers for research and development shall be granted a subsidy of up to 50% of the production cost of the first mask version of the product and 70% of the direct streaming cost, with an annual total of no more than 5 million yuan. for Shenzhen enterprises that have completed the streaming of full mask engineering products for the first time, a maximum of 50% of the first mask production cost and 50% of the streaming fee will be granted, and the total annual subsidy shall not exceed 7 million yuan.

(3) to enhance the semiconductor manufacturing capacity. Strengthen cooperation with integrated circuit manufacturing enterprises, plan and build integrated circuit production lines for logic and characteristic processes, and support the construction of high-end chip capacitors, inductors, resistors and other electronic components production lines. We will support the establishment of major semiconductor and integrated circuit manufacturing projects that represent the new development direction, and encourage the transformation and upgrading of existing integrated circuit production lines.

(4) catch up with and surpass the test level of high-end packaging. We will speed up the R & D and industrialization of power devices such as MOSFET modules and high-density memory packaging technology, focusing on breaking through advanced packaging core technologies such as wafer-level, system-level, bump, flip, silicon through-hole, panel-level fan-out, 3D, vacuum, Chiplet (core grain), as well as advanced wafer-level testing technologies such as pulse sequence testing and IC integrated probe cards, and subsidize them according to 10% of the actual investment in the project. No more than 10 million yuan for a single project.

(5) accelerate the maturation of compound semiconductors. Enterprises in the fields of communication equipment, new energy vehicles, power systems, rail transit and intelligent terminals are encouraged to promote and try out compound semiconductor products to enhance the competitiveness of systems and machine products. Enterprises that purchase more than 20 million yuan (including) of compound semiconductor products designed or manufactured in Shenzhen annually shall be subsidized at least 20% of the purchase amount, up to a maximum of 5 million yuan per year. Guide enterprises to participate in the formulation of technical standards in key links, seize the commanding heights of the industry, and enhance product market dominance and discourse power.

Third, speed up the breakthrough of basic support links. (6) speed up tackling key problems of EDA core technology. Promote the localization of the whole process of EDA tools such as analog, digital and RF integrated circuits. Support the research and development of EDA technologies such as advanced process, new generation of intelligence and ultra-low power consumption. We should strengthen the promotion and application of domestic EDA tools, encourage enterprises and scientific research institutions to buy or rent domestic EDA tools, and promote the introduction of domestic EDA tools into university curriculum teaching. Enterprises or scientific research institutions that purchase domestic EDA tools and software shall be subsidized according to no more than 70% of the actual expenditure, up to a maximum of 10 million yuan per year. Enterprises or scientific research institutions that rent domestic EDA tools software shall be subsidized according to no more than 50% of the actual expenditure, up to a maximum of 5 million yuan per year.

(7) to promote the independent control of key materials. Relying on backbone enterprises to speed up the R & D and production of semiconductor materials such as photomasks, photoresist, polyimide, sputtering targets, high-purity chemical reagents, electronic gases, etching fluids, cleaning agents, polishing solutions, functional additives for electroplating solutions, fluorinated coolants, ceramic powders, etc., the subsidy shall be up to 10 million yuan at 40% of the R & D expenses (including material verification and testing expenses). Support the first batch of new materials to enter the supply chain of key integrated circuit manufacturing enterprises, and give research and development units a reward of no more than 30% and a maximum of 20 million yuan according to the actual total sales of products within a certain period of time.

(8) break through the matching of core equipment and spare parts. Enterprises in our city are encouraged to carry out research and development of key integrated circuit equipment and components, and to promote the continuous research and development of high-end equipment components and system integration, such as testing equipment, thin film deposition equipment, etching equipment, cleaning equipment, high vacuum pump, and so on. Support the first set of key equipment and components to enter the supply chain of key integrated circuit manufacturing enterprises, and give the research and development unit no more than 30% of the total actual sales of products within a certain period of time. The maximum reward is 20 million yuan. Vigorously introduce domestic and foreign leading enterprises in the field of equipment and parts to settle in Shenzhen, giving an one-time settlement reward of no more than 30 million yuan.

(9) to increase support for tackling key core technologies. Further enhance the core competitiveness of Shenzhen's integrated circuit industry, enhance the overall independent innovation capability of the industry, and break the situation in which major key core technologies are controlled by others. We will subsidize key technological research in key areas, priority themes and key special projects of our city's integrated circuit industry. Guide enterprises to increase investment in research and development, and subsidize research and development expenses to Shenzhen integrated circuit enterprises that meet the requirements and carry out research and development activities. Rent subsidies will be given to integrated circuit enterprises with a newly introduced investment of more than 3 million yuan.

Fourth, gather strength to enhance the momentum of industrial development (10) actively undertake national special strategic tasks. Relevant units are encouraged to undertake major projects, major technological research and development plans and key R & D plans in the field of integrated circuits carried out by the National Development and Reform Commission, the Ministry of Industry and Information Technology, the Ministry of Science and Technology, and other ministries and commissions. According to the progress of state-allocated funds, a matching fund shall be given not more than 1:1, and the total amount shall not exceed 30% of the total investment of the project. For major projects put forward by key core enterprises that can solve the "bottleneck" problem of the integrated circuit industry chain but have not received state funds, no more than 30% supporting financial support can be given in stages according to the self-raised funds input of the enterprises. 1:1 supporting support will be given to those who have successfully applied for the National Industrial Innovation Center, the National Manufacturing Innovation Center and the National Technology Innovation Center.

(11) support enterprises to become bigger and stronger. Help enterprises to develop rapidly, increase market share, and constantly expand the scale of the industry. For Shenzhen integrated circuit EDA, IP and design enterprises with annual operating income exceeding 100 million yuan, 300 million yuan, 500 million yuan and 1 billion yuan for the first time, an one-time reward of 5 million yuan, 7 million yuan, 1000 yuan and 12 million yuan will be given to the core team of the enterprise, respectively. For Shenzhen integrated circuit manufacturing, packaging and testing, key equipment and materials enterprises with annual operating income exceeding 1 billion yuan, 2 billion yuan, 5 billion yuan and 10 billion yuan for the first time, the enterprise core team will be given an one-time reward of 5 million yuan, 7 million yuan, 1000 yuan and 12 million yuan respectively.

(12) strengthen the construction of industrial support platform. To build public service platforms such as manufacturing innovation center, industrial innovation center, IC design platform, equipment and materials R & D center, testing and certification center in the field of integrated circuits, relying on backbone enterprises and scientific research institutions, and jointly with upstream and downstream enterprises, universities and scientific research institutes, to build an incubation platform for small and medium-sized enterprises that meets the requirements of our city's industrial layout and has been recognized by the city. The subsidy shall be no more than 40% of the construction cost of the platform, up to 30 million yuan. After the platform is completed, the subsidy shall be no more than 15 million yuan per year according to the operation and service situation.

(13) to improve the environment for industrial investment and financing. Explore the establishment of a municipal investment fund for the integrated circuit industry, focusing on supporting the development of the integrated circuit industry. Support qualified enterprises to participate in project construction and operation through financing loans and financial leases, and discount interest according to the actual loan or financing part up to 2.5%, with a maximum discount period of no more than 5 years. Support enterprises to make full use of the development of listing and financing in the main board, gem, Science and Technology Innovation Board and other multi-level capital markets, and grant subsidies of no more than 15 million yuan in stages according to the listing process. Support insurance institutions to participate in the development of integrated circuit industry and guide insurance funds to carry out equity investment.

(14) promote the rapid growth of import and export trade. Set up an information exchange and supervision platform covering the whole process of customs clearance, optimize and simplify the import and export links and procedures of integrated circuit products, and establish a "whitelist" of integrated circuit enterprises, scientific research institutions and other pilot units in this city to facilitate customs clearance. The import guidance catalogue of key integrated circuit commodities shall be established, and enterprises shall import productive raw materials and consumables of integrated circuits for their own use, special building materials for purification rooms, supporting systems, integrated circuit production equipment and spare parts, and other commodities listed in the catalogue, and the cumulative annual import amount exceeds 50 million yuan, shall be subsidized according to 5% of the import amount, with a maximum of 5 million yuan per year. We will strictly implement the national preferential tax policy for integrated circuit enterprises, and allow the import value-added tax to be paid by stages for the import of new equipment for major integrated circuit projects.

(15) to support industry organizations to play a bridging role. Establish a semiconductor and integrated circuit industry alliance in the upper and lower reaches of the industrial chain, constantly converge and integrate global industrial resources and forces, and enhance the overall competitiveness of semiconductors and integrated circuits in Shenzhen. Support the development of industry alliances, trade associations and other social organizations, and give a maximum of 5 million yuan in funding according to the merits of the project. The recognized alliances, associations and other social organizations shall be subsidized according to 50% of the actual rent and property service management fees every year, and may be subsidized for three consecutive years, up to a maximum of 1 million yuan per year. Those who have made outstanding contributions to attracting investment shall be rewarded for attracting investment.

Fifth, construct the guarantee system of high-quality talents (16) strengthen the incentive guarantee of talents. Give full play to the role of market regulation, highlight use-oriented, market recognition and market evaluation, take talent market value and economic contribution as the main evaluation criteria, and establish a market-oriented incentive mechanism linked to talent market value and economic contribution. We will focus on supporting the introduction and retention of front-line R & D personnel, engineering and technical backbones and middle and senior management personnel, and the maximum amount of individual awards shall not exceed 5 million yuan. The talents engaged in basic research and core technology research and development in the list of key integrated circuit enterprises encouraged by the state shall be given stable support for a certain number of years. For the key integrated circuit units identified by the municipal department in charge of the industry, priority shall be given to the housing quota for talents.

(17) to implement the global talent backtracking program for integrated circuits. We will speed up the introduction of global high-end talents, innovation teams and management teams from key countries (regions). Set up a service organization for the introduction of overseas talents and a green channel for the return of overseas talents, open up the whole process service mechanism for the selection and retention of high-level overseas integrated circuit talents, provide agency services throughout the process, and issue a "Pengcheng Talent Card" for high-level talents. with the card, talents can directly handle the business of children's enrollment, talent housing, health care, incentives and subsidies.

(18) Industry-university linkage to train professionals at all levels. Give full play to the role of enterprises in personnel training, speed up the integration of industry and education, and encourage qualified universities (including technician colleges) to jointly build high-skilled personnel training bases in cooperation with integrated circuit enterprises. the training base projects that have been determined to meet the requirements shall be given an one-time subsidy of no more than 20% of the investment in base construction, up to a maximum of 20 million yuan. We will strengthen the professional construction of colleges and universities (including technician colleges), expand the enrollment scale of semiconductor majors, and focus on training a number of high-level and compound talents.

Sixth, to build a high-level characteristic industrial park (19) to optimize the supply of industrial space. The key area of semiconductor and integrated circuit industrial cluster is responsible for quantifying the annual industrial land and industrial housing indicators, which is coordinated by the municipal department in charge of industry. to ensure that the city's semiconductor and integrated circuit industry adds or upgrades 200000 square meters of industrial land or 500000 square meters of industrial housing supply every year. Adopt the mode of "tolerance and acceptance" and "parallel examination and approval", carry out the pre-examination of land site selection in advance, examine and approve the project selection plan and industrial development supervision agreement at the same time, improve the examination and approval efficiency and speed up the land transfer.

(20) to increase support for the construction of characteristic parks. For characteristic industrial parks that have been identified as newly built or transformed by existing industrial space, green channels will be opened in the links of project establishment, registration and examination and approval. nearby supporting roads, water supply, sewage, drainage, telecommunications and optical cables, power supply, natural gas and land formation and other "eight links and one flat" infrastructure. According to the actual needs, cross-regional double-circuit power supply backup facilities should be built to meet the high-intensity and uninterrupted power supply needs of integrated circuit manufacturing enterprises.

(21) strengthen supporting measures for environmental protection. For the characteristic park to be built, the municipal and district environmental protection departments will form a special class to provide one-to-one professional guidance services for environmental protection. We will improve the construction of the environmental infrastructure of the park, and encourage the park to increase investment in supporting facilities for the treatment of solid, liquid and gas pollutants, environmental monitoring, emergency prevention and control of environmental risks, and environmental informationization. Subsidies shall be granted according to no more than 50% of the construction cost, up to a maximum of 20 million yuan.

VII. Supplementary provisions the Shenzhen Municipal Development and Reform Commission shall be responsible for explaining these measures. If the relevant policies and regulations of the state, province or city are adjusted during the implementation period, these measures may be adjusted accordingly. Each responsible unit shall formulate and issue implementation rules or operating rules in a timely manner. All districts and industrial parks are encouraged to independently formulate supplementary supporting measures according to the characteristics of their respective industrial planning and layout. This measure and other similar preferential measures at the urban level shall no longer be supported if the enterprise chooses to apply independently in accordance with the principle of "not high but not low", does not repeat the subsidy, and has enjoyed policy support according to the "matter-by-case discussion" at the municipal and district levels.

This measure will take effect from X day of 2022 and will be valid for 5 years.

Welcome to subscribe "Shulou Technology Information " to get latest news, interesting things and hot topics in the IT industry, and controls the hottest and latest Internet news, technology news and IT industry trends.