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Gartner: the Localization of China's Semiconductor Manufacturing Industry continues to improve

2025-02-06 Update From: SLTechnology News&Howtos shulou NAV: SLTechnology News&Howtos > IT Information >

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Shulou(Shulou.com)11/24 Report--

October 8 news, Gartner Research Director Cao Menglin released the latest research results, the degree of localization of China's semiconductor manufacturing industry continues to improve.

According to the study, Chinese enterprises have made remarkable progress in some aspects of semiconductor manufacturing materials, wafer manufacturing equipment and device manufacturing technology. In some semiconductor manufacturing materials, such as silicon wafer, electronic special gas, CMP material and so on, Chinese enterprises have been able to support the manufacture of node chips in mature processes. In the major semiconductor manufacturing processes such as deposition, etching, ion implantation, CMP and cleaning, Chinese equipment manufacturers can support 28nm or even 14nm node manufacturing in some process steps. Some products can support 5-nanometer process nodes in some process steps.

Chinese material and equipment suppliers can seize the opportunity for semiconductor manufacturers to expand fab capacity and increase their market share in mature process node manufacturing. In addition, in order to reduce the risk of global supply chain disruption, Chinese semiconductor manufacturers will accelerate the verification process and increase the procurement of materials and equipment from domestic suppliers, which will further promote the development of the local ecosystem.

Chinese manufacturers still lack key technical capabilities in advanced photoresist, high-end lithography equipment and state-of-the-art process device manufacturing processes. In addition, various export restrictions in the United States (one of the reasons for global supply disruptions) have further restricted the development of China's local advanced semiconductor manufacturing technology.

Gartner estimates that by 2027, the proportion of key raw materials and key wafer manufacturing equipment from domestic manufacturers will exceed 50 per cent of China's mature process nodes (including traditional process nodes). The localization of advanced process node semiconductor manufacturing in China continues to improve, but the speed is far lower than that of mature process node manufacturing, and its localization requires more efforts from domestic manufacturers.

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