Shulou(Shulou.com)11/24 Report--

CTOnews.com Sept. 28, Intel CEO Kissinger in the Intel Open House 2022 event on the 28th, in addition to introducing a number of new products, also mentioned the small Chip Interconnection Industry Alliance (UCIe).

CTOnews.com learned that at present, there are more than 80 manufacturers in the UCIe Industry Alliance. At the same time, including the senior vice president of TSMC business development and representatives of Samsung also appeared to attend Intel events by way of online connection to support the development of the alliance.

CTOnews.com has reported that Intel, AMD, Arm, Google Cloud, Meta, Microsoft, Qualcomm, Samsung and TSMC announced in March this year the establishment of a small chip interconnection standard UCIe, which aims to establish a global open ecosystem that supports small chip design and promote the development of related technologies and interconnections.

UCIe (Universal Chiplet Interconnect Express) will be an open small chip interconnection protocol, which will meet customer requirements for customized packaging.

It is reported that the founder has approved the UCIe 1.0 specification, which aims to establish ubiquitous interconnection at the package level, making use of mature PCI Express (PCIe) and Compute Express Link (CXL) industry standards.

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