Shulou(Shulou.com)11/24 Report--

CTOnews.com Sept. 25, Intel researcher Wilfred Gomes and Intel Chief engineer Slade Morgan confirmed the details of their 14-generation cool series in a recent blog post.

First, the 14th generation of Meteor Lake and its successor, Arrow Lake, will belong to the same generation of "client architecture", and they will all adopt the same design, that is, slot and base (compatibility unknown).

In addition, Intel also introduced in detail its first "tiled" or "modular" design, and expounded its PC market plan for the next 3-5 years.

Starting with the 14th generation of processors, each new generation will be a combination of different product solutions, similar to the above two models, with different process nodes, core architecture, and number of cores.

By decomposing the key computational elements, we can rotate the IP and let them find the right process at the right time. Different products require different number of cores, different combinations of performance and efficient cores, and different cache sizes.

Intel said that through this "decomposition" design, it has the flexibility to adapt to each market segment without destroying the rest of the design. This should mean that Meteor Lake and Arrow Lake are products for different market segments.

As can be seen from the figure, Intel Meteor Lake (released in 2023) and Arow Lake will adopt the packaging process of Foveros (3D) and 36 μ m pitch, based on Intel 4 (formerly 7nm) and 20A (formerly 5nm, expected to be mass produced in the first half of 2024), respectively.

▲ ▼ with official PPT

Intel confirmed that Arrow Lake will be in exactly the same configuration as Meteor Lake, P core will upgrade from Redwood Cove to Lion Cove, and E core will switch from Crestmont to Skymont, and the number of cores should be increased to at least 32 (mainly E core).

Thanks to the modular design, Arrow Lake will be able to retain Meteor Lake's quasi-system solutions, including SoC and IO modules, speeding up architecture and process upgrades while reducing costs.

The subsequent Lunar Lake confirmation is the Foveros, 25 μ m pitch packaging process, using the same LGA-1851 slot as the Meteor Lake, in line with Intel's principle of using the same design for every second-generation platform.

CTOnews.com has reported that the 14th generation Core Meteor Lake CPU will adopt a new small chip (Tile) architecture, with three main Tile: IO Tile, SOC Tile and Compute Tile. Compute Tile includes CPU Tile and GFX Tile. CPU Tile will use a new hybrid core design to provide higher performance with lower power consumption, and GPU is also a new architecture, up to 192 EU.

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