Shulou(Shulou.com)11/24 Report--

CTOnews.com Sept. 12, according to the Taiwan media Economic Daily, the wafer foundry TSMC 2nm process will be produced in 2025, and the market is expected to be ahead of its rivals Samsung and Intel.

The advanced process of TSMC is progressing smoothly, 3nm will be mass produced in the second half of this year, and the upgraded 3nm (N3E) process will be mass produced one year after 3nm mass production, that is, 2023, and 2nm is expected to produce in 2025.

TSMC's 2nm plant will be launched in Baoshan Phase II of Zhuke. The "Bamboo Administration" has begun the construction of public facilities, and TSMC's 2nm plant has also begun to carry out site preparation operations.

TSMC 2nm uses nano-wafer architecture for the first time, which can increase the frequency by 10 to 15 per cent at the same power consumption compared with the N3E process. Power consumption is reduced by 25% to 30% at the same frequency.

Wei Zhe-Jia, president of TSMC, stressed at the technology forum a few days ago that TSMC 2nm will be the technology with the highest density and the best performance. The market is also optimistic, TSMC 2nm progress will be ahead of competitors Samsung and Intel.

CTOnews.com learned that although it had been slightly conservative in the 3nm generation, in any case, the width of the Fin was close to the actual limit, and if it went down again, it would encounter a bottleneck, so the foreign legal person estimated that TSMC's 2nm advanced process would use the high-end architecture of the encircling gate field effect transistor GAAFET to produce 2nm chips.

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