Shulou(Shulou.com)11/24 Report--

CTOnews.com, August 31 (Xinhua)-- Kioxia has announced that its latest generation of embedded flash memory products that meet the JEDEC eMMC Ver 5.1 standard and are suitable for the consumer market have begun to come out.

Armor's new eMMC 5.1 product uses the updated 3D Flash to improve reliability and performance, offering 64G and 128G capacity, and the terminal product is expected to be fully available in October this year.

According to reports, the latest BiCS 3D flash memory uses an improved architecture to achieve a more stable sequential write performance. The time from idle to automatic hibernation is reduced from the current 200 milliseconds to 2 milliseconds, a difference of about 100 times, thus further extending battery life and achieving faster performance.

CTOnews.com learned that as a leading supplier of consumer applications / mobile storage products, Armor has been actively supporting e-MMC solutions since 2007 and became a UFS supplier in early 2013.

The new mid-range capacity released this time not only provides 64 / 128GB capacity options, but also integrates flash memory + master in a single package.

The following are the main features of the new consumer e-MMC based on the latest generation of BiCS FLASH 3D flash memory:

● improves the architecture to reduce internal write magnification to achieve more stable continuous write performance.

● pre-programmed user data for higher reliability before the customer manufacturing process / sending back flow.

The ● idle to auto sleep time is reduced by 100 × 6 compared with the previous generation, which helps to extend the battery life.

● achieves faster performance by accessing multiple naked slices within the device.

● supports the JEDEC eMMC 5.1 standard (HS400) for faster interface rates.

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