Shulou(Shulou.com)11/24 Report--

CTOnews.com August 31 news, DigiTimes said that Nvidia is stepping up cooperation with TSMC on high-end chips. According to sources, Nvidia is considering using TSMC's SoIC technology for HPC chips.

As Moore's Law is about to face its physical limit, advanced packaging technologies, including small chips (Chiplet) and heterointegration, have been a hot topic in the field of efficient computing (HPC) chips since the Hot Chips conference in late August 2022.

According to public information, SOIC (Small Outline Integrated Circuit Package) is a small-form integrated circuit package, which refers to a small-form integrated circuit with no more than 28 external leads, which is derived from SOP (Small Out-Line Package) packaging. It is generally available in both wide-body and narrow-body packages, and is one of the surface mount integrated circuit packages. Compared with the equivalent DIP package, it reduces about 30-50% of space and about 70% in thickness.

To put it simply, SoIC is an innovative multi-chip stack technology of TSMC, which can carry out wafer-level bonding technology for processes below 10nm. The technology has no protruding bonding structure, so it has better performance.

HPC designs usually use small chips of various package types. MCM is ideal for smaller, low-power designs. The 2.5D design is suitable for artificial intelligence (AI) workloads because GPU, which is tightly connected to HBM, provides a powerful combination of computing power and memory capacity. With vertically stacked CPU and fast memory access, 3D IC is an ideal choice for general HPC workloads.

TSMC expects HPC to remain the strongest growth platform until at least 2025, according to TSMC's head of HPC business development. The HPC domain defined by TSMC includes CPU, GPU and AI accelerators.

In addition, TSMC's HPC business development director not only reiterated that TSMC's 5 nm family continued to be strong in the third year of mass production, but also shared that TSMC's N4X and N4P, an extension of TSMC's 5 nm family, were favored by many customers, and said that TSMC 3 nm was put into production in the second half of the year.

CTOnews.com learned that in April this year, TSMC said that its Q1 contributed 41% of its revenue from HPC this year, surpassing mobile phones as the largest source of revenue for the first time.

There is also news from the supply chain that Nvidia expects the annual growth of HPC chip performance to reach about 200,250%. If it goes well, it can launch a new product with an enhanced version of 5nm around the third quarter at the earliest.

Welcome to subscribe "Shulou Technology Information " to get latest news, interesting things and hot topics in the IT industry, and controls the hottest and latest Internet news, technology news and IT industry trends.