Shulou(Shulou.com)11/24 Report--

CTOnews.com August 25 news, August 24 local time, Howell Group announced the release of the industry's first and only three-layer stackable BSI global shutter (GS) image sensor OG0TB.

The ultra-small image sensor, which is used for eyeball and face tracking in AR / VR / MR and Metaverse consumer devices, is only 1.64mm x 1.64mm in 2.2micron pixel size and 1ram 14.46inch optical format (OF), Howe said.

In addition, this CMOS image sensor has 400 × 400 resolution and ultra-low power consumption. Howell data shows that the OG0TB BSI GS image sensor consumes less than 7.2MW at 30 frames per second.

CTOnews.com learned that OG0TB GS uses Howie PureCel Plus-S wafer stacking technology and uses a three-layer stackable sensor with a pixel size of 2.2 microns in the 1max 14.46in optical format, achieving a resolution of 400 × 400 and supporting multi-point MIPI, CPHY, SPI and other interfaces.

It is reported that the OG0TB GS image sensor will provide samples in the third quarter of 2022 and begin mass production in the second half of 2023.

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