Shulou(Shulou.com)11/24 Report--

CTOnews.com August 24 news, TSMC has confirmed that it will mass produce 3nm process in September, the initial yield is better than 5nm, the first batch of 3nm production capacity is not unexpected is Apple M2 Pro and Intel carve up, but the initial production capacity will not be too much.

However, the original N3 process is mainly aimed at early customers who have strong investment ability and pursue new processes, such as Apple, but it is also very limited, such as the time is late and the application is not wide enough.

However, after 3nm, TSMC will launch an upgraded version of the N3E process, the enhanced version of 3nm Enhanced, next year, which will further improve performance, reduce power consumption and expand the range of applications, reducing power consumption by 34% compared with the N5 with the same performance and density, increasing performance by 18% at the same power consumption and density, or increasing transistor density by 60%.

CTOnews.com once reported that analysts in the Industrial and Commercial Times believe that N3e technology will become the main mass production force of major manufacturers, including Apple's iPhone 15 series of A17 processors, the next generation of M3 processors, and AMD's future Zen5, and so on.

It is said that the M3 can be used in products such as the MacBook Air, and Apple is likely to increase the display size of this model to improve heat dissipation through stronger cooling solutions. Other potential products include the updated iPad Pro series, as well as the updated iMac, as well as possible future iPad Air. M3 will probably use 4 performance cores and 4 efficiency cores again, just like M2 and M1.

According to industry practice, TSMC will first test the performance and trial production yield of the N3E process this year, and is expected to produce on a large scale in the second half of 2023. And the "core list +" just leaked a copy of TSMC's internal PPT, showing that its N3E process is progressing very well, at least in terms of yield.

According to PPT, the yield of TSMC's new generation N3E process is higher than expected, with an average 256Mb SRAM yield of about 80% for N3E, about 80% for mobile devices and HPC chips, and even more than 92% for ring oscillators.

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