Shulou(Shulou.com)11/24 Report--

According to DIGITIMES, supply chain sources said that the back-end demand for automotive MCU and MPU is still in the stage of rapid development, and both OSAT and packaging materials suppliers can see clear orders by the end of the year.

According to sources, leading OSAT companies, including Sun and Moon Technologies, have won outsourced orders for automotive MCU backends for the next two quarters from IDM International, helping to build the shipping momentum of lead frames needed to support mainstream QFP processes for such chips.

Taiwan's back-end partners began negotiating 2023 orders with US, Japanese and European IDM in the third quarter of 2022 and found that these IDM vendors had become cautious about the business outlook for the second half of 2023, according to sources.

Sources pointed out that the automotive chip IDM is expected to slightly reduce orders for outsourced back-end business in the second half of 2023, but it remains to be seen whether demand for automotive MCU and MPU will reverse in the second half of next year.

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