Shulou(Shulou.com)11/24 Report--

Thank CTOnews.com netizens AMD for challenging the future, Daniel Wu in South China, and OC_Formula for their clue delivery! CTOnews.com8 news on March 20, as an essential hardware of the computer, the capacity of memory is always the bigger the better. Recently, Samsung held a communication meeting with AMD memory experts to discuss Samsung's development in DDR5 memory, including the issue of DDR5 memory capacity.

Compared with the previous DDR4, DDR5 memory reduces the voltage to 1.1V, the frequency can reach more than 7200MHz, the number of bank doubles to 32, and the number of prefetched bits doubles to 16n. Samsung plans to increase its memory core capacity to 32Gb and stack layers to 8H by 2023. In 2024, Samsung plans to introduce a single 1TB DDR5 memory, which will use 32 8-Hi 32GB stacks to fit the server platform released in 2024-2025.

In addition to the increase in capacity, Samsung also plans to further increase the speed of DDR5 memory. Samsung PPT says it will release DDR5-7200 in 2025, with transmission rates expected to reach 10000+MT / s.

CTOnews.com learned that there had been news that Samsung was developing DDR6 memory, which would use MSAP encapsulation technology and was expected to achieve a transfer rate of about 12800Mbps. For DDR6 memory, it should be easier to reach 1TB on a single strip. But now it seems that Samsung may have realized the design of a single 1TB in the era of DDR5.

Although a single 1TB is too expensive for consumers, capacity is more important for server platforms. At present, the EPYC 7004 series of Zen4 architecture can have 96 cores, which means that it needs more and more memory.

Welcome to subscribe "Shulou Technology Information " to get latest news, interesting things and hot topics in the IT industry, and controls the hottest and latest Internet news, technology news and IT industry trends.