Shulou(Shulou.com)05/31 Report--

Intel is currently executing on its plan to successfully develop five nodes in four years, an aggressive roadmap that measures toward Angstrom sometimes referred to as "Intel acceleration."

Scotten Jones, president and owner of semiconductor consulting firm IC Knowledge, was initially skeptical of ambitious semiconductor plans, but his head appears to have been turned by recent investor events.

Jones wrote an article for SemiWiki this week explaining his confidence in Intel's plans to regain its technology leadership by 2025. Until recently, Jones told investment firms that Intel could never catch up to TSMC. However, recent events and a redrawn road map have changed his thinking.

Intel CEO Pat Gelsinger's leadership has injected a huge dose of ambition into Intel. But while it's easy to talk about a good game, delivery is another matter entirely.

As part of celebrating the opening of the $3 billion D1X Mod3 plant expansion project in Oregon, Intel released a slideshow. (You can read the full 11 pages of our story about the new plant expansion here.) On deck page five, a subtle change in the roadmap caught Jones 'attention (see single slide above). From 2025 to 2024, Intel has quietly but confidently introduced the most advanced 18A process on the roadmap.

In his analysis of Intel's plans, Jones looks back a few years and paints a picture of how Intel got into this mess-losing its technology and process leadership (e.g., 14nm stomping in water, 10nm getting into trouble). More interestingly, the semiconductor boss and IEEE senior member opened his RGB crystal ball and talked to us about the rest of 2022, all the way to 2025.

Jones said that in the next few years, in the three-horse race between Intel, TSMC and Samsung, all companies will have various sticky patches when making major changes. These significant changes may adversely affect the road map, but on the other hand they are critical for capturing competitive advantage.

From 2022 to 2025, Intel will increasingly use EUV machines. It will also begin introducing horizontal nanosheet (HNS) technology (a process that has recently slowed Samsung down) and debut alongside RibbonFET. The use of technology called PowerVia is also improving power transmission. Intel has been ticking up to 18A.

Welcome to subscribe "Shulou Technology Information " to get latest news, interesting things and hot topics in the IT industry, and controls the hottest and latest Internet news, technology news and IT industry trends.